Dear customerLAPIS Semiconductor Co., Ltd. ("LAPIS Semiconductor"), on the 1 st day of October,2020, implemented the incorporation-type company split (shinsetsu-bunkatsu) in whichLAPIS established a new company, LAPIS Technology Co., Ltd. (“LAPISTechnology”) and LAPIS Technology succeeded LAPIS Semiconductor’s LSI business.Therefore, all references to "LAPIS Semiconductor Co., Ltd.", "LAPIS Semiconductor"and/or "LAPIS" in this document shall be replaced with "LAPIS Technology Co., Ltd."Furthermore, there are no changes to the documents relating to our products other thanthe company name, the company trademark, logo, etc.Thank you for your understanding.LAPIS Technology Co., Ltd.October 1, 2020