Yaesu FTDX1200 Technical Supplement

Also see for FTDX1200 Series: Information for Customers Operating Information for Customers Operating Reference book Installation and interconnections SCOPE Feature Enhancement

Contents

Yaesu FTDX1200 Technical Supplement Manual pdf 1 page image

©2015 YAESU MUSEN CO., LTD.SpecificationsExploded View & Miscellaneous PartsBlock DiagramConnection DiagramAlignmentBoard Unit (Schematics, Layouts & Parts)MAIN UnitCNTL UnitLOCAL UnitPA UnitTUNER UnitDSP UnitDISPLAY-1 UnitLED UnitSW-A UnitSW-B UnitVR-A UnitJACK UnitMIC UnitHF/50 MHz TransceiverFTDX1200Technical SupplementEH058H90CYAESU MUSEN CO., LTD.Tennozu Parkside Building2-5-8 Higashi-Shinagawa, Shinagawa-ku, Tokyo 140-0002 JapanYAESU USA6125 Phyllis Drive, Cypress, CA 90630, U.S.A.YAESU UKUnit 12, Sun Valley Business Park, Winnall CloseWinchester, Hampshire, SO23 0LB, U.K.IntroductionThis manual provides technical information necessaryfor servicing the FTDX1200 HF/50 MHz Transceiver.Servicing this equipment requires expertise in handlingsurface-mount chip components. Attempts by non-qualified persons to service this equipment may resultin permanent damage not covered by the warranty, andmay be illegal in some countries.Two PCB layout diagrams are provided for each double-sided circuit board in the Transceiver. Each side of isreferred to by the type of the majority of componentsinstalled on that side ("leaded" or "chip-only"). Inmost cases one side has only chip components, andthe other has either a mixture of both chip and leadedcomponents (trimmers, coils, electrolytic capacitors, ICs,etc.), or leaded components only.While we believe the technical information in thismanual to be correct, YAESU MUSEN assumes noliability for damage that may occur as a result oftypographical or other errors that may be present. Yourcooperation in pointing out any inconsistencies in thetechnical information would be appreciated.ContentsImportant Note1) This transceiver was assembled using Pb (lead) free solder, based on the RoHS specification.Only lead-free solder (Alloy Composition: Sn-3.0Ag-0.5Cu) should be used for repairs performed on this ap-paratus. The solder stated above utilizes the alloy composition required for compliance with the lead-freespecification, and any solder with the above alloy composition may be used.2) Risk of explosion if battery is replaced by an incorrect type. Dispose of used batteries according to the instruc-tions.