4D systems gen4-HMI Series Datasheet
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gen4-HMI Display Modulesgen4-uLCD-50D Page 14 of 29 www.4dsystems.com.au5.5. Application PCB SupportThe gen4 5.0” Diablo16 Integrated Display Module isdesigned to accommodate a range of applications, andtherefore is suited for those wanting to make acustomised module, without the need for piggy-backor daughter boards mounted on headers.On the back of the gen4 module, the display relatedcircuitry will be found, which is recessed into theplastic. The level of the plastic on the back of the gen4module is higher than the tallest component on thedisplay circuit PCB, meaning an Application PCB can bemounted on the back of the gen4, without affectingthe display related circuitry.The image below (4.3” model depicted) shows a mockApplication PCB on the back of the gen4 display (Bluearea). It features a cut-out in the PCB so access to themicro-SD socket on the gen4’s display board ispossible, however this may or may not be requireddepending on the application and if the micro-SDsocket is utilised or requiring access once theApplication PCB is applied.The 30 way FFC flex cable out of the gen4 into theapplication board can either turn up through a slot inthe application board, or can travel down under thegen4 plastic and emerge at the bottom, and then intothe application board (as depicted above).The micro-SD socket is a latch type, so it is accessiblefrom the top, rather than a push/push or push/pullstyle which is accessible from the side.5.6. RF / EMI Shielding SupportAs per what is written in section 5.5 (Application PCBSupport), there is an option for extended RF shieldingand EMI protection on this module.On the back of the gen4’s display PCB, are groundedplated ‘X pads’, which make contact with the metalhousing of the display.Where the Application PCB is shown to sit in Section5.5, can house a small metal shield of the same size.This shield is used instead of, or underneath anApplication PCB, to aid the on-board electronics in theprevention from potential RF or EMI signals.On the top of the display PCB is more GND pads, whichcan have a pogo pin or similar device mounted onthem, which can make contact with this metal shield.The display electronics are then sandwiched betweenthe display’s metal housing, and the metal shield, allconnected together with a common ground.NOTE: There are no guarantees these steps willincrease chances or grant access to EMI relatedcertifications, however the gen4 has the capability toutilise shielding of the modules electronics, should theneed arise. This may or may not assist the User withprotecting the device against EMI/EMF/RF type noise,depending on the source, strength and type of noisepresent, however should aid in the protection. |
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