230 Appendix BMicrosoft® Windows ® 7 Environment TestVendor Type Description PNCPUIntel Arrandale 2.13G(Ci3330M)IC CP80617004122AG SLBMD C2 2.13GPGA988Intel Arrandale 2.26G(Ci3350M)IC CP80617004161AC SLBPK C2 2.26GPGA988Intel Arrandale 2.26G(Ci5430M)IC CP80617004161AD SLBPN C2 2.26GPGA988Intel Arrandale 2.4G(Ci5520M)IC CP80617004119AE SLBNB C2 2.4GPGA988PIntel Arrandale 2.53G(Ci5540M)IC CP80617004116AD SLBPG C2 2.53GPGA988Intel Arrandale 2.66G(Ci7620M)IC CP80617003981AH SLBPD C2 2.66GPGA 988PIntel Q3GG C2 2.13G CPU Intel Core i3 330M PGA 2.13G 35WArrandale, TJ90, VT, 3M L3Intel Q3LN C2 2.26G CPU Intel Core i3 350M PGA 2.26G 35WArrandale, TJ90, VT, 3M L3Intel Q3LR C2 2.26G CPU Intel Core i5 430M PGA 2.26G ARD,uP to SC 2.53G, 3M L3RAM SODIMM DDR3-1G 1066SAMSUNG 1G DDR3-1066 DDR3 MODU SAM M471B2873EH1-CF81GB/1066ELDIPA 1G DDR3-1066 DDR3 MODU SAM EBJ11UE6BDS0-AE-F1GB/1066HYNIX 1G DDR3-1066 DDR3 MODU HYN HMT112S6BFR6C-G7N0 1G/1066RAM SODIMM DDR3-2G 1066MICRON 2G DDR3-1066 MT16JSF25664HZ-1G1F1SAMSUNG 2G DDR3-1066 DDR3 MODU SAM M471B5673EH1-CF82G/1066ELDIPA 2G DDR3-1066 DDR3 MODU ELP EBJ21UE8BDS0-AE-F2G/1066HYNIX 2G DDR3-1066 DDR3 MODU HYN HMT125S6BFR8C-G7N0 2G/1066RAM SODIMM DDR3-4G 1066SAMSUNG 4G DDR3-1066 M471B5273BH1-CF8ELPIDA 4G DDR3-1066 Memory NONE SO-DIMM DDRIII 1066 4GBdummy P/N LFRAM SODIMM DDR3-1G 1333SAMSUNG 1G DDR3-1333 M471B2873FHS-CH9RAMSODIMMDDR3-2G1333SAMSUNG 2G DDR3-1333 M471B5673FH0-CH9 LFRAM SODIMM DDR3-4G 1333SAMSUNG 4G DDR3-1333 M471B5273CH0-CH9
