36 Chapter 1Hardware Specifications and ConfigurationsItem T7600 T7400 T7200 T5600 T5500CPU speed (GHz) 2.33 2.16 2 1.83 1.66Bus speed (MHz) 667 667 667 667 667Bus/Core Ratio 14 13 12 11 10L2 cache size (MB) 4 4 4 2 2L2 cache speed (GHz) 2.33 2.16 2 1.83 1.66Package type (pin) 479/478 479/478 479/478 479/478 479/478Manufacturing technology (nm) 65 65 65 65 65Thermal design power 34W 34W 34W 34W 34WThermal specification ( o C) 100 100 100 100 100Core voltage (V) 1.0375 ~1.301.0375 ~1.301.0375 ~1.301.0375 ~1.301.0375 ~1.30Item T2700 T2600 T2500 T2400 T2300CPU speed (GHz) 2.33 2.16 2 1.83 1.66Bus speed (MHz) 667 667 667 667 667Bus/Core Ratio 13 13 12 11 10L2 cache size (MB) 2 2 2 2 2L2 cache speed (GHz) 2.33 2.16 2 1.83 1.66Package type (pin) 478 478 479/478 478 478Manufacturing technology (nm) 65 65 65 65 65Thermal design power 31W 31W 31W 31W 31WThermal specification ( o C) 100 100 100 100 100Core voltage (V) 1.0375 ~1.301.0375 ~1.301.0375 ~1.301.0375 ~1.301.0375 ~1.30Item SpecificationPackage Micro-FCBGA 1466-pinPower 1.05V (core), 1.5V, VCCSM (DDR2 = 1.8V), 2.5V, 3.3VFeature • Processor host bus support• Integrated SDRAM controller up to 4GB (2 SODIMM support)Integrated SDRAM clock buffer to support 2 SODIMM• External Graphics interface for PCI Express Architecture support• DMI x 2 and DMI x 4 for connection between GMCH and ICH7MItem SpecificationPackage BGA 652-pinPower 1.05V (core), 1.5V, 3.3V, 5V, CMOS I/O