PC 6170 User’s ManualA.3 Advanced Chipset FeaturesSince the features in this section are related to the chipset on theCPU board and are completely optimized, you are not recommendedto change the default settings in this setup table unless you are welloriented with the chipset features.CMOS Setup Utility-Copyright © 1984-2001 Aw ard Softw areAd vanced Chipset Featu resDRAM Timing By SPD Ite m He lpCA Ss Latency Ti me 2.5Acti ve to Re charge De lay 7 Menu Level fD RAM RA S # to CA S# De l a y 3DRAM RAS# Re charge 3D RAM Data In te g r ity Mo de No n -E CCMGM Co re Fr eq uency Au to Max 400/333MHzSystem B IOS C acheable EnableVideo BIOS Ca cheable Di sabledMemory Ho le At 15 M-16M Di sabledDelayed Transacti on Di sabledDelay Prior to Thermal 16 MinAGP Aperture S i ze (M B) 64In it Di splay Fi rst Onboard** On-Chip VGA Se tting **On-Chip VG A EnabledOn-Chip Frame Bu ffe r Size 32 MBBoot Displ ay Au to Panel Scaling Au toPanel Number 640 x480ÇÈ ÆÅ : Mo ve E n te r: S e le ct +/- / P U /P D : Va lu e F 1 0 : S a ve E S C : E xi t F 1 :Gene ral He lpF 5 : P r evious Values F6: Fail- Saf e D e f a ults F7: O p timize d D e f a ultsSDRAM CAS latency TimeYou can select CAS latency time in HCLKs 2, 3, or Auto. The boarddesigner should set the values in this field, depending on the DRAMinstalled. Do not change the values in this field unless you changespecifications of the installed DRAM or the installed CPU.DRAM Data Integrity ModeThis option sets the data integrity mode of the DRAM installed in thesystem. The default setting is “Non-ECC”.SBC83810 BIOS Setup 45