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iii PowerEdge M520 Technical GuideTable of contents1 System Overview .................................................................................................................................................................5Introduction .........................................................................................................................................................................5New technologies ............................................................................................................................................................. 62 System features ................................................................................................................................................................... 7Comparison of PowerEdge systems ............................................................................................................................... 7Specifications ..................................................................................................................................................................... 83 Module views and features .............................................................................................................................................. 11Module views ..................................................................................................................................................................... 11Module features ................................................................................................................................................................ 134 Processors .......................................................................................................................................................................... 15Processor features ............................................................................................................................................................ 15Supported processors ......................................................................................................................................................16Chipset ................................................................................................................................................................................165 Memory ............................................................................................................................................................................... 17Supported memory .......................................................................................................................................................... 17Memory configurations ...................................................................................................................................................18Memory speed ..................................................................................................................................................................19Memory RAS features.......................................................................................................................................................196 Storage ................................................................................................................................................................................ 21Internal storage ................................................................................................................................................................. 21Storage controllers ........................................................................................................................................................... 217 Networking and mezzanine cards ................................................................................................................................ 24System management integration ................................................................................................................................. 24Mezzanine cards .............................................................................................................................................................. 248 Power, thermal, and acoustics ...................................................................................................................................... 26Power consumption and energy efficiency ................................................................................................................ 26Power supply units .......................................................................................................................................................... 27Thermal and acoustics.................................................................................................................................................... 279 Operating systems and virtualization ........................................................................................................................... 29Supported operating systems........................................................................................................................................ 29Supported virtualization ................................................................................................................................................. 3010 Dell OpenManage systems management ..................................................................................................................... 31Systems management solutions .................................................................................................................................... 31OpenManage systems management ........................................................................................................................... 32Dell server management operations ............................................................................................................................ 37Appendix A. Additional specifications .......................................................................................................................... 39Module dimensions and weight .................................................................................................................................... 39Video specifications ........................................................................................................................................................ 39Environmental specifications ........................................................................................................................................ 40USB peripherals .................................................................................................................................................................41Appendix B. Standards compliance ............................................................................................................................. 42Appendix C. Additional resources................................................................................................................................. 44Appendix D. System board block diagram .................................................................................................................. 46
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