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DellDell PowerEdge M610x Technical Guide iiiTable of Contents1 Product Comparison ........................................................................................... 11.1 Overview .................................................................................................. 11.1.1 Unparalleled PowerEdge Flexibility ............................................................. 11.1.2 Uncompromised Performance .................................................................... 11.1.3 Simplified Systems Management ................................................................. 11.2 Product Comparison ..................................................................................... 22 New Technologies .............................................................................................. 42.1 Overview .................................................................................................. 43 System Information ............................................................................................ 53.1 Overview .................................................................................................. 54 Mechanical ...................................................................................................... 84.1 Chassis Description....................................................................................... 84.2 Dimensions and Weight .................................................................................. 84.3 Internal Module View .................................................................................... 94.4 Security .................................................................................................... 94.5 Cover Latch ............................................................................................... 94.6 TPM (Trusted Platform Module) ........................................................................ 94.7 Power Off Security ....................................................................................... 94.8 USB Key .................................................................................................. 104.9 Battery ................................................................................................... 104.10 Field Replaceable Units (FRU)........................................................................ 104.11 User Accessible Jumpers, Sockets, and Connectors ............................................... 105 Power, Thermal, Acoustic .................................................................................. 115.1 Power Supplies ......................................................................................... 115.2 Power Efficiency ....................................................................................... 115.3 Thermal Operating and Storage Specifications .................................................... 115.4 Acoustics ................................................................................................ 126 Processors ..................................................................................................... 146.1 Overview ................................................................................................ 146.2 Features ................................................................................................. 146.3 Supported Processors .................................................................................. 166.4 Processor Installation .................................................................................. 167 Memory ........................................................................................................ 177.1 Overview ................................................................................................ 177.2 DIMMs Supported ....................................................................................... 177.3 Memory Features ....................................................................................... 187.4 Memory Speed Limitations ............................................................................ 188 Chipset ........................................................................................................ 208.1 Overview ................................................................................................ 208.2 I/O Hub (IOH) ........................................................................................... 208.2.1 QuickPath Interconnect (QPI) .................................................................. 208.2.2 PCI Express ........................................................................................ 208.2.3 Direct Media Interface (DMI) ................................................................... 208.2.4 I/O Controller Hub 9 (ICH9)..................................................................... 208.2.5 PCI Express Mezzanine Connectors ............................................................ 219 BIOS ............................................................................................................ 229.1 Overview ................................................................................................ 229.2 Supported ACPI States ................................................................................. 22
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