Dell PowerEdge R910 Technical Manual

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Dell PowerEdge R910 Technical Guide iiiTable of Contents1 Product Comparison ........................................................................................... 61.1 Overview .................................................................................................. 61.2 Purpose-Built for Reliability ............................................................................ 61.3 Efficient Infrastructure .................................................................................. 61.4 Intelligent Platforms, Connected Foundations ....................................................... 61.5 Comparison ............................................................................................... 72 Key Technologies............................................................................................... 82.1 Overview .................................................................................................. 82.2 Intel Processors Feature Set ............................................................................ 82.3 Memory Controller ....................................................................................... 92.4 Internal Dual SD Module (IDSM) ........................................................................ 92.5 10Gb Embedded NIC ..................................................................................... 93 System Information .......................................................................................... 104 Mechanical .................................................................................................... 134.1 Chassis Description..................................................................................... 134.2 Dimensions and Weight ................................................................................ 134.3 Front Panel View and Features ...................................................................... 144.4 Back Panel View and Features ....................................................................... 154.5 Power Supply Indicators ............................................................................... 154.6 NIC Indicators ........................................................................................... 154.7 Rails and Cable Management ......................................................................... 164.8 Fans ...................................................................................................... 164.9 Security .................................................................................................. 164.9.1 Cover Latch ....................................................................................... 164.9.2 Bezel ............................................................................................... 164.9.3 Hard Drive ......................................................................................... 164.9.4 Trusted Platform Module (TPM) ................................................................ 164.9.5 Power Off Security ............................................................................... 174.9.6 Intrusion Alert .................................................................................... 174.9.7 Secure Mode ...................................................................................... 174.10 USB Key .................................................................................................. 174.11 Battery ................................................................................................... 174.12 Field Replaceable Units (FRU)........................................................................ 174.13 User Accessible Jumpers, Sockets, and Connectors ............................................... 175 Power, Thermal, Acoustic .................................................................................. 185.1 Power Supplies and Power Subsystem .............................................................. 185.2 Environmental Specifications......................................................................... 205.3 Thermal.................................................................................................. 215.4 Acoustics ................................................................................................ 216 Processors ..................................................................................................... 246.1 Overview ................................................................................................ 246.2 Features ................................................................................................. 246.3 Supported Processors .................................................................................. 256.4 Processor Configurations .............................................................................. 256.5 Additional Processor Information .................................................................... 267 Memory ........................................................................................................ 277.1 Overview ................................................................................................ 277.2 Slots and Risers ......................................................................................... 277.3 Key Features of the Memory Subsystem ............................................................ 277.4 Memory Speed Limitations ............................................................................ 28