Ebyte E19-433M30S User Manual

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Ebyte E19-433M30S User Manual Manual pdf 8 page image

Chengdu Ebyte Electronic Technology Co., Ltd. E19-433M30S User ManualCopyright ©2012–2018，Chengdu Ebyte Electronic Technology Co.,Ltd. 76.FAQ6.1 Communication range is too short The communication distance will be affected when obstacle exists. Data lose rate will be affected by temperature, humidity and co-channel interference. The ground will absorb and reflect wireless radio wave, so the performance will be poor when testing near ground. Sea water has great ability in absorbing wireless radio wave, so performance will be poor when testing near the sea. The signal will be affected when the antenna is near metal object or put in a metal case. Power register was set incorrectly, air data rate is set as too high (the higher the air data rate, the shorter thedistance). The power supply low voltage under room temperature is lower than 2.5V, the lower the voltage, the lower thetransmitting power. Due to antenna quality or poor matching between antenna and module.6.2 Module is easy to damage Please check the power supply source, ensure it is 2.0V~3.6V, voltage higher than 3.6V will damage the module. Please check the stability of power s ource, the voltage cannot fluctuate too much. Please make sure antistatic measure are taken when installing and using, high frequency devices have electrosta ticsusceptibility. Please ensure the humidity is within limited range, some parts are sensitive t o humidity. Please avoid using modules under too high or too low temperature.6.3 BER(Bit Error Rate) is high There are co-channel signal interference nearby, please be away from interference sources or modify frequency a ndchannel to avoid interference; Poor power supply may cause messy code. Make sure that the power supply is reliable. The extension line and feeder quality are poor or too long, so the bit error rate is high;7.Production guidance7.1 Reflow soldering temperatureProfile Feature Curve characteristics Sn-Pb Assembly Pb-Free AssemblySolder Paste Solder paste Sn63/Pb37 Sn96.5/Ag3/Cu0.5Preheat Temperature min （Tsmin） Min preheating temp. 100℃ 150℃Preheat temperature max (Tsmax) Mx preheating temp. 150℃ 200℃Preheat Time (Tsmin to Tsmax)(ts) Preheating time 60-120 sec 60-120 secAverage ramp-up rate(Tsmax to Tp) Average ramp-up rate 3℃/second max 3℃/second maxLiquidous Temperature (TL) Liquid phase temp. 183℃ 217℃Time（tL）Maintained Above（TL） Time below liquid phase line 60-90 sec 30-90 secPeak temperature（Tp） Peak temp. 220-235℃ 230-250℃

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