Ebyte E22 Series User Manual

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Contents

SX1262/SX1268 wireless module E22 series user manualCopyright ©2012–2017，Chengdu Ebyte Electronic Technology Co.,Ltd.9NO. Instruction for connection between module and MCU1 IO0, IO1, IO2, IO3 means IO ports of MCU.2DIO1、DIO2 are GPIO，configurable for multiple functions；DIO2 can connect to TXEN，without connecting to IO of MCU，for controlling RF switch TX, Pleasesee more in SX126x datasheet, can be floated when free.3 E22(433M22S) uses DIO3 internally to power 32MHz TCXO.4 Well grounded with large area for grounding，small power ripple, filter capacitor should be installed and near to VCC and GND.5 E22(400M30S)：It is recommended to add a 200R protection resistor to the RXD/TXD of the external MCU.4. Production Guidance4.1. Reflow Soldering TemperatureProfile Feature Sn-Pb Assembly Pb-Free AssemblySolder Paste Sn63/Pb37 Sn96.5/Ag3/Cu0.5Preheat Temperature min （Tsmin） 100℃ 150℃Preheat temperature max (Tsmax) 150℃ 200℃Preheat Time (Tsmin to Tsmax)(ts) 60-120 sec 60-120 secAverage ramp-up rate(Tsmax to Tp) 3℃/second max 3℃/second maxLiquidous Temperature (TL) 183℃ 217℃Time（tL）Maintained Above（TL） 60-90 sec 30-90 secPeak temperature（Tp） 220-235℃ 230-250℃Aveage ramp-down rate（Tp to Tsmax） 6℃/second max 6℃/second maxTime 25℃ to peak temperature 6 minutes max 8 minutes max4.2. Reflow Curving Diagram

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