Ebyte E73 2G4M04S1B User Manual
                 | |
Copyright ©2012–2017，Chengdu Ebyte Electronic Technology Co., Ltd. 125. Production Guidance5.1. Reflow Soldering TemperatureProfile Feature Curve feature Sn-Pb Assembly Pb-Free AssemblySolder Paste Solder paste Sn63/Pb37 Sn96.5/Ag3/Cu0.5Preheat Temperature min （Tsmin） Minimum preheating temperature 100℃ 150℃Preheat temperature max (Tsmax) Maximum preheating temperature 150℃ 200℃Preheat Time (Tsmin to Tsmax)(ts) Preheating time 60-120 sec 60-120 secAverage ramp-up rate(Tsmax to Tp) Average rising rate 3℃/second max 3℃/second maxLiquidous Temperature (TL) Liquid phase temperature 183℃ 217℃Time（tL）Maintained Above（TL） Time above liquidus 60-90 sec 30-90 secPeak temperature（Tp） Peak temperature 220-235℃ 230-250℃Aveage ramp-down rate（Tp to Tsmax） Average descent rate 6℃/second max 6℃/second maxTime 25℃ to peak temperature Time of 25 ° C to peak temperature 6 minutes max 8 minutes max5.2. Reflow Soldering Curve |
Related manuals for Ebyte E73 2G4M04S1A
This manual is suitable for:
manualsdatabase
Your AI-powered manual search engine