Ebyte E78-400M22S User Manual
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Chengdu Ebyte Electronic Technology Co.,Ltd E78-400M22S user manualCopyright ©2012–2019，Chengdu Ebyte Electronic Technology Co,;Ltd 88. Production guidance8.1 Reflow soldering temperatureProfile Feature Curve characteristics Sn-Pb Assembly Pb-Free AssemblySolder Paste Solder paste Sn63/Pb37 Sn96.5/Ag3/Cu0.5Preheat Temperature min (Tsmin) Min preheating temp. 100℃ 150℃Preheat temperature max (Tsmax) Mx preheating temp. 150℃ 200℃Preheat Time (Tsmin to Tsmax)(ts) Preheating time 60-120 sec 60-120 secAverage ramp-up rate(Tsmax to Tp) Average ramp-up rate 3℃/second max 3℃/second maxLiquidous Temperature (TL) Liquid phase temp. 183℃ 217℃Time(tL)Maintained Above(TL) Time below liquid phaseline 60-90 sec 30-90 secPeak temperature(Tp) Peak temp. 220-235℃ 230-250℃Average ramp-down rate(Tp to Tsmax) Average ramp-down rate 6℃/second max 6℃/second maxTime 25℃ to peak temperature Time to peak temperaturefor 25℃ 6 minutes max 8 minutes max8.2 Reflow soldering curve |
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