H3C MSR810 Installation Manual

Also see for MSR810: Command reference Troubleshooting guide Command reference Configuration guide Command reference

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H3C MSR810 Installation Manual Manual pdf 10 page image

3Table 2 Temperature/humidity requirements in the equipment roomModel Operating temperature Operating humidity• H3C MSR810{ RT-MSR810-W{ RT-MSR810-W-DB{ RT-MSR810-LM{ RT-MSR810-W-LM• H3C MSR810 Series{ RT-MSR810{ RT-MSR810-LM-CNDE-SJK{ RT-MSR810-10-PoE{ RT-MSR810-LM-HK{ RT-MSR810-W-LM-HK{ RT-MSR810-LM-GL{ RT-MSR810-W-LM-GL0°C to 40°C (32°F to 104°F) 5% RH to 90% RH, noncondensing• RT-MSR810-LME• RT-MSR810-LMS• RT-MSR810-LMS-EA• RT-MSR810-LUS0°C to 40°C (32°F to 104°F) 0% RH to 95% RH, noncondensingCleanlinessDust buildup on the chassis might result in electrostatic adsorption, which causes poor contact ofmetal components and contact points, especially when indoor relative humidity is low. In the worstcase, electrostatic adsorption can cause communication failure.Table 3 Dust concentration limit in the equipment roomSubstance Concentration limit (particles/m3)Dust particles ≤ 3 x 104(No visible dust on the tabletop in three days)NOTE:Dust diameter ≥ 5 μmThe equipment room must also meet strict limits on salts, acids, and sulfides to eliminate corrosionand premature aging of components, as shown in Table 4.Table 4 Harmful gas limits in an equipment roomGas Maximum concentration (mg/m 3)SO 2 0.2H2 S 0.006NH3 0.05NO 2 0.04Cl2 0.01