NXP Semiconductors TDA8932B Product Data Sheet

NXP Semiconductors TDA8932B Product Data Sheet Manual pdf 16 page image

TDA8932B_3 © NXP B.V. 21 June 2007. All rights reserved.Product data sheet Rev. 03— 21 June 2007 16 of 48NXP Semiconductors TDA8932BClass-D audio amplifier10. Limiting values[1] VP = VDDP1 − V SSP1 = V DDP2 − VSSP2.[2] Measured with respect to pin INREF; Vx < V DD + 0.3 V.[3] Measured with respect to pin VSSD(HW) ; Vx < V DD + 0.3 V.[4] Measured with respect to pin CGND; Vx < V DD + 0.3 V.[5] VSS = VSSP1 = VSSP2; V DD = V DDP1 = V DDP2.[6] Current limiting concept.[7] Human Body Model (HBM); Rs = 1500 Ω; C = 100 pFFor pins 2, 3, 11, 14 and 15 V esd = ±1800 V.[8] Machine Model (MM); Rs = 0 Ω; C = 200 pF; L = 0.75 μH.11. Thermal characteristicsTable 8. Limiting valuesIn accordance with the Absolute Maximum Rating System (IEC 60134).Symbol Parameter Conditions Min Max UnitVP supply voltage asymmetrical supply [1] −0.3 +40 VVx voltage on pin xIN1P, IN1N, IN2P, IN2N [2] −5 +5 VOSCREF, OSCIO, TEST [3] VSSD(HW) − 0.3 5 VPOWERUP, ENGAGE,DIAG[4] VCGND − 0.3 6 Vall other pins [5] VSS − 0.3 VDD + 0.3 VIORM repetitive peak outputcurrentmaximum outputcurrent limiting[6] 4 - AT j junction temperature - 150 °CT stg storage temperature −55 +150 °CT amb ambient temperature −40 +85 °CP power dissipation - 5 WVesd electrostatic dischargevoltageHBM [7] −2000 +2000 VMM [8] −200 +200 VTable 9. Thermal characteristicsSymbol Parameter Conditions Min Typ Max UnitSO32 packageR th(j-a) thermal resistance from junctionto ambientfree air natural convectionJEDEC test board [1] - 41 44 K/W2 layer application board [2] - 44 - K/WΨj-lead thermal characterizationparameter from junction to lead- - 30 K/WΨj-top thermal characterizationparameter from junction to top[3] - - 8 K/W