Preface3 0 to 60 centigrade is the suitable temperature. (The figure comes from therequest of the main chipset) Generally speaking, dramatic changes in temperature may lead to contactmalfunction and crackles due to constant thermal expansion andcontraction from the welding spots’ that connect components and PCB.Computer should go through an adaptive phase before it boots when it ismoved from a cold environment to a warmer one to avoid condensationphenomenon. These water drops attached on PCB or the surface of thecomponents can bring about phenomena as minor as computer instabilityresulted from corrosion and oxidation from components and PCB or asmajor as short circuit that can burn the components. Suggest starting thecomputer until the temperature goes up. The increasing temperature of the capacitor may decrease the life ofcomputer. Using the close case may decrease the life of other devicebecause the higher temperature in the inner of the case. Attention to the heat sink when you over-clocking. The higher temperaturemay decrease the life of the device and burned the capacitor.User’s NoticeCopyright of this manual belongs to the manufacturer. No part of this manual,including the products and software described in it may be reproduced,transmitted or translated into any language in any form or by any meanswithout written permission of the manufacturer.This manual contains all information required to use this mother-board seriesand we do assure this manual meets user’s requirement but will change,correct any time without notice. Manufacturer provides this manual “as is”without warranty of any kind, and will not be liable for any indirect, special,incidental or consequential damages (including damages for loss of profit, lossof business, loss of use of data, interruption of business and the like).