• SIM card interface• Stereo audio codecs and amplifiers• A/D converter• Regulators• Vibra interface• Digital interface (CBUS)EMC ASIP (Appcation Specified Integrated Passive) have been integrated inside the ASIC. It includes biasingpassives for microphone , EMC filter for SIM, microphones etc.Device memoriesCombo memoryThe application memory of the device consists of DDR/NAND combo memory. The stacked DDR/NANDapplication memory has 1 Gbit of DDR memory and 2 Gbit of flash memory.Audio conceptAudio HW architectureThe functional core of the audio hardware is built around three ASICs: RAPIDOYAWE engine ASIC, mixed signalASIC Avilma and D/A converter DAC33.DAC33 converts digital audio signal to analog and is routed to the FM Transmitter and amplifier TPA6130which provides an interface for the transducers and the accessory connector.AVilma provides analog signal for earpiece and for D-class audio amplifier TPA2012D2, which drivesintegrated stereo handsfree speakers.There are four audio transducers:• 8x12 mm dynamic earpiece• Two 8x12 mm dynamic speakers• Digital MEMS (microelectromechanical systems) microphoneAvilma provides an output for the dynamic vibra component. All wired audio accessories are connected tothe AV accessory connector. A Bluetooth audio and FM radio module, which is connected to RAPIDOYAWE,supports Bluetooth audio and FM radio functionality.RM-484; RM-485; RM-486System Module and User InterfaceIssue 1 COMPANY CONFIDENTIAL Page 8 –25Copyright © 2009 Nokia. All rights reserved.
