there is a possibility of a shock hazard, and the equipment shouldbe repaired and checked before it is returned to the customer.ELECTROSTATICALLY SENSITIVE (ES) DEVICESSome semiconductor (solid state) devices can be damaged easily by static electricity. Suchcomponents commonly are called Electrostatically sensitive (ED) Devices. Examples of typicalES devices are integrated circuits and some field-effect transistors and semiconductor “chip”components. The following techniques should be used to help reduce the incidence ofcomponent damage caused by static electricity.1. Immediately before handling any semiconductor component orsemiconductor-equipped assembly, drain off any electrostaticcharge on your body by touching a known earth ground. /Alternatively, obtain and wear a commercially availabledischarging wrist trap device, which should be removed forpotential shock reasons prior to applying power to the unit undertest.2. After removing an electrical assembly equipped with ES devices,place the assembly on a conductive surface such as aluminumfoil, to prevent electrostatic charge buildup or exposure of theassembly.3. Use only a grounded tip soldering iron to solder or unsolder ESdevices.4. Use only an anti-static solder removal device classified as “anti-static” can generate electrical charges sufficient to damage ESdevices.5. Do not use freon-propelled chemicals. These can generateelectrical charges sufficient to damage ES devices.6. Do not remove a replacement ES device from its protectivepackage until immediately before you are ready to install it. /(most replacement ES devices are package with leads electricallyshorted together by conductive foam, aluminum foil orcomparable conductive material).7. Immediately before removing the protective material from theleads of a replacement ES device, touch the protective material tothe chassis or circuit assembly into which the device will be4PDF created with pdfFactory Pro trial version www.pdffactory.com