2. Warning2.1. Prevention of Electrostatic Discharge (ESD) to ElectrostaticSensitive (ES) DevicesSome semiconductor (solid state) devices can be damaged easily by static electricity. Suchcomponents commonly are called Electrostatic Sensitive (ES) Devices. Examples of typical ESdevices are integrated circuits and some field-effect transistor-sand semiconductor "chip"components. The following techniques should be used to help reduce the incidence ofcomponent damage caused by electrostatic discharge (ESD).1. Immediately before handling any semiconductor component orsemiconductor-equipped assembly, drain off any ESD on yourbody by touching a known earth ground. Alternatively, obtain andwear a commercially available discharging ESD wrist strap, whichshould be removed for potential shock reasons prior to applyingpower to the unit under test.2. After removing an electrical assembly equipped with ES devices,place the assembly on a conductive surface such as aluminumfoil, to prevent electrostatic charge buildup or exposure of theassembly.3. Use only a grounded-tip soldering iron to solder or unsolder ESdevices.4. Use only an anti-static solder removal device. Some solderremoval devices not classified as "anti-static (ESD protected)"can generate electrical charge sufficient to damage ES devices.5. Do not use freon-propelled chemicals. These can generateelectrical charges sufficient to damage ES devices.6. Do not remove a replacement ES device from its protectivepackage until immediately before you are ready to install it. (Mostreplacement ES devices are packaged with leads electricallyshorted together by conductive foam, aluminum foil orcomparable conductive material).7. Immediately before removing the protective material from the4