components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typicalES devices are integrated circuits and some field-effect transistorsand semiconductor "chip"components. The following techniques should be used to help reduce the incidence ofcomponent damage caused by electro static discharge (ESD).1. Immediately before handling any semiconductor component orsemiconductor-equipped assembly, drain off any ESD on yourbody by touching a known earth ground. Alternatively, obtain andwear a commercially available dischargingESD wrist strap, whichshould be removed for potential shock reasons prior to applyingpower to the unit under test.2. After removing an electrical assembly equipped with ES devices,place the assembly on a conductive surface such as alminum foil,to prevent electrostatic charge buildup or exposure of theassembly.3. Use only a grounded-tip soldering iron to solder or unsolder ESdevices.4. Use only an anti-static solder removal device. Some solderremoval devices not classified as "anti-static (ESD protected)"can generate electrical charge sufficient to damage ES devices.5. Do not use freon-propelled chemicals. These can generateelectrical charges sufficient to damage ES devices.6. Do not remove a replacement ES device from its protectivepackage until immediately before you are ready to install it. (Mostreplacement ES devices are packaged with leads electricallyshorted together by conductive foam, alminum foil orcomparableconductive material).7. Immediately before removing the protective material from theleads of a replacement ES device, touch the protective material tothe chassis or circuit assembly into which the device will beinstalled.CautionBe sure no power is applied to the chassis or circuit, and observeall other safety precautions.8. Minimize bodily motions when handling unpackaged replacementES devices. (Otherwise hamless motion such as the brushingtogether of your clothes fabric or the lifting of your foot from a6