1 ABOUT LEAD FREE SOLDER (PbF: Pb free) 41.1. Suggested PbF Solder 41.2. How to Recognize that Pb Free Solder is Used 52 FOR SERVICE TECHNICIANS 53 CAUTION 54 OPERATING INSTRUCTIONS 64.1. Battery 64.2. Location of Controls 84.3. Display 94.4. Settings 104.5. Troubleshooting 145 DISASSEMBLY INSTRUCTIONS 175.1. Base Unit 175.2. Handset 186 HOW TO REPLACE THE HANDSET LCD 197 TROUBLESHOOTING GUIDE 207.1. Check Power 217.2. Check Battery Charge 227.3. Check Link 237.4. Check the RF part 247.5. Check Handset Transmission 307.6. Check Handset Reception 307.7. Check Caller ID 308 ADJUSTMENT AND TEST MODE 318.1. Test Mode Flow Chart for Base Unit 318.2. Test Mode Flow Chart for Handset 358.3. X501 (Base Unit), X201 (Handset) Check 398.4. Adjust Battery Low Detector Voltage (Handset) 398.5. Base Unit Reference Drawing 408.6. Handset Reference Drawing 418.7. Frequency Table 428.8. How to Clear User Setting (Handset Only) 439 DESCRIPTION 449.1. Frequency 449.2. FHSS (Frequency Hopping Spread Spectrum) 449.3. Signal Flowchart in the Whole System 4610 EXPLANATION OF LINK DATA COMMUNICATION 4710.1. Calling 4710.2. To Terminate Communication 4710.3. Ringing 4711 BLOCK DIAGRAM (BASE UNIT_MAIN) 4812 BLOCK DIAGRAM (BASE UNIT_RF PART) 4913 CIRCUIT OPERATION (BASE UNIT_MAIN) 5013.1. DSP (Digital Speech/Signal Processing: IC501) 5013.2. EEPROM (IC611) 5013.3. Power Supply Circuit 5113.4. Reset Circuit 5313.5. Telephone Line Interface 5413.6. Parallel Connection Detect Circuit 5513.7. Calling Line Identification (Caller ID) 5613.8. 2.4GHz Mod/Demod Circuit (Base Unit RF Part) 5714 BLOCK DIAGRAM (HANDSET_MAIN) 5815 BLOCK DIAGRAM (HANDSET_RF PART) 5916 CIRCUIT OPERATION (HANDSET) 6016.1. Construction 6016.2. Power Supply Circuit 6116.3. Charge Circuit 6216.4. Ringer and Handset SP-Phone 6216.5. Sending Signal 6316.6. Reception Signal 6316.7. 2.4GHz Mod/Demod Circuit (Handset RF Part) 6417 SIGNAL ROUTE 6518 CPU DATA (BASE UNIT) 6618.1. IC501 6619 CPU DATA (HANDSET) 6719.1. IC201 6720 EXPLANATION OF IC TERMINALS (RF PART) 6820.1. IC901 6821 HOW TO REPLACE A FLAT PACKAGE IC 6921.1. PREPARATION 6921.2. FLAT PACKAGE IC REMOVAL PROCEDURE 6921.3. FLAT PACKAGE IC INSTALLATION PROCEDURE 7021.4. BRIDGE MODIFICATION PROCEDURE 7022 CABINET AND ELECTRICAL PARTS (BASE UNIT) 71Note:Because CONTENTS 4 is the extract from the Operating Instructions of this model, it is subject to change without notice. You candownload and refer to the original Operating Instructions on TSN Server for further information.CONTENTS Page Page2KX-TG2448BXF / KX-TG2448BXS / KX-TGA254BXF / KX-TGA254BXS