1 ABOUT LEAD FREE SOLDER (PbF: Pb free) 41.1. Suggested PbF Solder 41.2. How to recognize that Pb Free solder is used 52 FORSERVICE TECHNICIANS 53 CAUTION 54 OPERATING INSTRUCTIONS 64.1. Battery 64.2. Location ofControls 84.3. Displays 94.4. Settings 104.5. Troubleshooting 165 DISASSEMBLY INSTRUCTIONS 195.1. Base Unit 195.2. Handset 206 ASSEMBLY INSTRUCTIONS 216.1. Fix the LCD to P.C. Board (Handset) 217 TROUBLESHOOTING GUIDE 227.1. Check Battery Charge 227.2. Check Link 237.3. Check the RF Part 247.4. Check Handset Transmission 287.5. Check Handset Reception 287.6. Check Caller ID 288 ADJUSTMENT AND TEST MODE 298.1. Test Mode Flow Chart for Base Unit 298.2. Test Mode Flow Chart for Handset 338.3. X801 (Base Unit), X201 (Handset) Check 378.4. Adjust Battery Low Detector Voltage (Handset) 378.5. Base Unit Reference Drawing 388.6. Handset Reference Drawing 408.7. Frequency Table 418.8. How to Clear User Setting (Handset Only) 429 DESCRIPTION 439.1. Frequency 439.2. FHSS (Frequency Hopping Spread Spectrum) 439.3. Signal Flowchart in the Whole System 4510 EXPLANATION OF LINK DATA COMMUNICATION 4610.1. Calling 4610.2. To Terminate Communication 4610.3. Ringing 4611 BLOCK DIAGRAM (BASE UNIT_MAIN) 4712 BLOCK DIAGRAM (BASE UNIT_RF PART) 4813 CIRCUIT OPERATION (BASE UNIT_MAIN) 4913.1. DSP (Digital Speech/Signal Processing: IC501) 4913.2. EEPROM (IC700) 5013.3. Power Supply Circuit 5013.4. Reset Circuit 5213.5. Telephone Line Interface 5313.6. Auto Disconnect Circuit 5513.7. Parallel Connection Detect Circuit 5613.8. Calling Line Identification (Caller ID) 5713.9. 2.4GHz Mod/Demod Circuit (Base Unit RF Part) 5814 BLOCK DIAGRAM (HANDSET_MAIN) 5915 BLOCK DIAGRAM (HANDSET_RF PART) 6016 CIRCUIT OPERATION (HANDSET) 6116.1. Construction 6116.2. Power Supply Circuit 6216.3. Charge Circuit 6316.4. Ringer and Handset SP-Phone 6316.5. Sending Signal 6416.6. Reception Signal 6416.7. 2.4GHz Mod/Demod Circuit (Handset RF Part) 6517 SIGNAL ROUTE 6618 CPU DATA (BASE UNIT) 6718.1. IC501 6719 CPU DATA (HANDSET) 6819.1. IC201 6820 EXPLANATION OF IC TERMINALS (RF UNIT) 6920.1. IC901 6921 HOW TO REPLACE A FLAT PACKAGE IC 7021.1. PREPARATION 7021.2. FLAT PACKAGE IC REMOVAL PROCEDURE 7021.3. FLAT PACKAGE IC INSTALLATION PROCEDURE 7121.4. BRIDGE MODIFICATION PROCEDURE 71Note:Because CONTENTS 4 is the extract from the Operating Instructions of this model, it is subject to change without notice. You candownload and refer to the original Operating Instructions on TSN Server for further information.CONTENTS Page Page2KX-TG2480BXS / KX-TGA248BXS