67KX-TG7731S/KX-TG7732S/KX-TG7733S/KX-TGA470S13 Miscellaneous13.1. How to Replace the LLP (Leadless Leadframe Package) ICNote:This description is only applied on the model with Shield case.13.1.1. Preparation• PbF (: Pb free) Solder• Soldering IronTip Temperature of 700 °F ± 20 °F (370 °C ± 10 °C)Note:We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with lessexperience could overheat and damage the PCB foil.• Hot Air Desoldering ToolTemperature: 608 °F ± 68 °F (320 °C ± 20 °C)13.1.2. Caution• To replace the IC efficiently, choose the right sized nozzle of the hot air desoldering tool that matches the IC package.• Be careful about the temperature of the hot air desoldering tool not to damage the PCB and/or IC.13.1.3. How to Remove the IC1. Heat the IC with a hot air desoldering tool through the P.C.Board.2. Pick up the IC with tweezers, etc. when the solder is melted completely.Note:• Be careful not to touch the peripheral parts with tweezers, etc. They are unstable.When it is hard to melt the solder completely, heat it with a hot air desoldering tool through the IC besides through theP.C.Board.3. After removing the IC, clean the P.C.Board of residual solder.P.C.BoardICHot Air Desoldering ToolTweezers, etc.P.C.BoardICP.C.Board Hot Air Desoldering Tools