PAN9420 Wi-Fi Module3 PAN9420 ModuleDesign Guide Rev. 1.0 Page 93.4 Pattern RecommendationNote:If the module is used withthe internal ceramic chipantenna the gray markedarea of module antennaarea ( 5,0 x 3,1 mm2 ) andthe right side of motherPCB edge are restricted.Means no ground plane,no signal pattern and ingeneral no metal shouldbe placed.min. 15 mmmin. 15 mmNote:If the module is used withthe internal ceramic chipantenna, the blue markedarea should be used toplace a ground plane.36 2229,00 mm13,50 mmTop View1513,10 mm1718192021424140393837ChipAntennaF1 F2 F3 F4 F5Pad Type 1 = 4 x 1.30mm x 1.30mmPad Type 2 = 38 x 0.80mm x 1.00mmPad Type 3 = 30 x 0.80mm x 0.80mmE1 E2 E3 E4 E5D1 D2 D3 D4 D5C1 C2 C3 C4 C5B1 B2 B3 B4 B5A1 A2 A3 A4 A52 3 4 5 6 7 8 9 10 11 12 13 1435 34 33 32 31 30 29 28 27 26 25 24 235.0 mmMother PCB edge16PCB footprint recommendationPattern land same land dimension as module pad typeResist mask 50μm bigger land size as pad type to each directionGNDTHERMOGNDTHERMOGNDTHERMOGNDTHERMOMother PCB edgePad Type 4 = 4 x 2.40mm x 2.40mmPin 16 - RF50 Ohm RF pad for theconnection to an externalantennaIt is recommended to extendthe ground plane for moduleto get best RF characteristicand heat rejection condition.3.5 Solder and Resist MaskThe following requirements must be met: The Resist Mask should be circumferential 50 μm bigger than the pad size ( 3.3 LandPattern). The Solder Mask apertures should have the diameter as the pads ( 3.3 Land Pattern);they are separated in two parts with the shown distance and a shifting.