PIRA32 Microcontrollerm32.pdf - page 14 © 2016 Pira.cz5 PACKAGE DETAILS5.1 28-Lead Skinny Plastic Dual In-Line – 300 mil Body (PDIP)Units INCHESDimension Limits MIN TYP MAXNumber of Pins n 28Pitch p .100Top to Seating Plane A .140 .150 .160Molded Package Thickness A2 .125 .130 .135Base to Seating Plane A1 .015 - -Shoulder to Shoulder Width E .300 .310 .325Molded Package Width E1 .275 .285 .295Overall Length D 1.345 1.365 1.385Tip to Seating Plane L .125 .130 .135Lead Thickness c .008 .012 .015Upper Lead Width B1 .040 .053 .065Lower Lead Width B .016 .019 .022Overall Row Spacing § eB .320 .350 .430Mold Draft Angle Top  5° 10° 15°Mold Draft Angle Bottom  5° 10° 15°Notes:§ Significant CharacteristicDimension D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010”(0.254 mm) per side.

PIN DIAGRAMS AND DESCRIPTION

Internal logical structure (simplified)

ELECTRICAL CHARACTERISTICS

DESIGN NOTES

Digital-to-Analog converter

Output low-pass filter

CONNECTION DIAGRAMS

Reference connection diagram

Schematic diagram

Part list

PACKAGE DETAILS

Lead Plastic Small Outline – Wide, 300 mil Body (SOIC)

RDS PIRA32 Manual

PIRA32