Samsung HPR4272X/XAC Service Manual

Circuit DescriptionSamsung Electronics 13-17■ A name of main part of Logic Board and vocabulary.Item Name Description① LVDS Connector The connector to receive the RGB, H, V, DATAEN and DCLK signals that have been LVDS encoded through themain board.② Y Connector The connector to output the control signal for the Y drive board.③ X Connector The connector to output the control signal for the X drive board.④ E-Buffer board Connector The connector to output the address data and the control signal to the E-buffer board.⑤ F-Buffer board Connector The connector to output the address data and the control signal to the F-buffer board.⑥ Power Connector The connector to receive power (5V, 3.3V) for the Logic board.⑦ ASIC CHIP The main processor that generates and outputs the logic drive signal and the address data.⑧ MICOM LOADING 5PIN CONNECTOR(Debug only) The connector to load the Micom drive program. The program is loaded by connecting to the GA-WRITER.■ About Logic BoardThe Logic Board consists of a Logic Main board, which processes the main signal input through LVDS and creates the addressdriver output and X,Y drive signals, and a Buffer board, which buffers the output signal and outputs the signal to the Address DriverIC (TCP IC).Logic Board Function RemarkLogic Main- Video Signal Processing (W/L, error diffusion, APC)- Outputs the Address Driver Control and Data Signals to the Buffer board.- Outputs the XY Drive Board Control SignalBuffer Board Lower E Buffer board Outputs data and controls signals to the bottom left TCP IC.Lower F Buffer board Outputs data and controls signals to the bottom right TCP IC.