Samsung ML-6050 Service Manual

Also see for ML-6050: Product guide User guide Service manual User manual

Contents

Reference Information3-4 Samsung ElectronicsINSTALLING1. Clean the area where the new part is to be mount-ed.2. Apply a water soluble flux.3. Set part correctly into position and prevent it fromshifting.4. Use a sharp soldering iron tip. Bring the tip close tothe part contact without actually touching it. Meltthin (0.3mm) solder between the tip and part sothat it flows into the part contact.5. Check work quality with a magnifying lens.3-2-5. Chip VRs, Chip TrimmerCapacitors, Diode and Tr.TYPESThe types of parts are as follows:· Chip VRs· Chip Trimmer Capacitors· Diode· TransistorsREMOVING1. Using two soldering irons.a. Use small-flat-blade tips.b. Heat the leads of the part simultaneously.c. When the solder melts, grasp and remove thepart with the soldering iron tips.INSTALLING1. Clean the area where the new part is to be mount-ed.2. Apply a water soluble flux.3. Set part correctly into position and prevent is fromshifting.4. Use a sharp soldering iron tip. Bring close to thepart contact without actually touching it. Melt thin(0.3mm) solder between the tip and part so that itflows into the part contact.3-2-6. Chip ICsTYPESThe types of chip ICs are as follows:1. SOP (Small Outline Package) IC2. SSOP (Shrink Small Outline Package) IC3. VSOP (Very Small Outline Package) IC4. QFP (Quad Flat Package) IC5. VQFP (Very Quad Flat Package) IC6. PLCC (Plastic Leaded Chip Carrier) IC7. TSOP (Thin Small Outline Package) ICREMOVING1. Using special desoldering iron:a. Select the tip according to the size shape of theIC.b.“Tin” the tip with a small amount of the IC leads.c. Set the tip squarely over the IC leads.d. When the solder melts, carefully twist the iron.e. Raise and remove the IC.2. Using a shaped air-blower unit:a. Select the correct nozzle.b. Select the temperature and air-blow(suggested : temperature : 7, air-blow:4)c. Engage the IC removing tool.d. Use the air-blow the preheat the IC for about 5seconds, then heat with the nozzle until the ICremove lifts the part from the board.INSTALLING1. Use desoldering wire to remove the previous solder2. Clean the location.3. Apply water soluble flux.4. Position the IC and solder two pins at oppositesides.5. Use a sharp tipped soldering iron and carefully sol-der each pin. (After gaining experience, a thickertip can be used for better work efficiency)6. Remove any solder bridges with desoldering wire.