Samsung ElectronicsService ManualReference Information11-211.2 Acronyms and AbbreviationsThe table in the below explains abbreviations used in this service manual.The contents of this service manual are declared with abbreviations in many parts. Please refer to thetable.ADC Analog-to-Digital-ConversionAP Access PointAC Alternating CurrentASIC Application Specific Integrated CircuitASSY AssemblyBIOS Basic Input Output SystemBLDC Motor Brushless DC MotorCIS Contact Image SensorCMOS Complementary Metal OxideSemiconductorCN ConnectorCON ConnectorCPU Central Processing UnitdB DecibeldBA A-Weighted decibeldBm Decibel milliwattDC Direct CurrentDCU Diagnostic Control UnitDIMM Dual In-line Memory ModuleDPI Dot Per InchDRAM Dynamic Random Access MemoryDVM Digital VoltmeterECP Enhanced Capability PortECU Engine Control UnitEEPROM Electronically ErasableProgrammable Read Only MemoryEMI Electro Magnetic InterferenceEP Electro photographicEPP Enhanced Parallel PortFCOT First Copy Out TimeFFC FLexiable FLat CableLAN local area networkLBP Laser Beam PrinterEPP Enhanced Parallel PortF/W FirmwareFCF/FCT First Cassette Feeder/FirstCassette TrayFISO Front-In, Side-OutFPOT First Print out TimeGDI Windows Graphic Device InterfaceGIF Graphic Interchange FormatGND GroundHBP Host Based PrintingHDD Hard Disk DriveHTML Hyper Text Transfer ProtocolHV High VoltageHVPS High Voltage Power SupplyI/F InterfaceI/O Input and Outputlb Pound(s)IC Integrated CircuitICC International Color ConsortiumIDE Intelligent Drive Electronics orIntegrated Drive ElectronicsIEEE Institute of Electrical andElectronics Engineers. IncIOT Image Output Terminal (Color print-er, Copier)IPA Isopropy Alcohol