3-24CIRCUIT DESCRIPTIONSamsung ElectronicsRepair Manual3-3-2 KEY FEATURESOverview(1) 0.5μm C-MOS process(TLM), 208-PIN QFP, STD85 library(2) Frequency : 50 MHz(3) On-Chip oscillator(4) Method : Raster scanning method(5) Image Sauce : 300 dpi CIS(6) Scanning Mode• color gray image : each 8 bits / RGB• mono gray image : 8 bits / pixel• binary image : 1 bit / pixel (for text/photo/mixed mode)(7) Maximum scanning width : A4, 300 dpi(8) A/D conversion depth : 12bitsPixel processing structure• Minimum pixel processing time : 4 system clocks• High speed pipelined processing method(Shading correction, Gamma correction, Enlargement/Reducement, and Binarization)Shading Correction(1) White shading correction support for each R/G/B(2) White shading data memory : 3x8Kx12bits = 288Kbits 384Kbits (external)(3) Black shading data memory : 3x8Kx12bits = 288Kbits 384Kbits (external)Gamma Correction(1) Independent Gamma table for each RGB component(2) Gamma table data memory : 3x1Kx8bits = 24Kbits (internal)Binarization (mono)(1) 256 Gray’s halftone representation for Photo document : 3x5 EDF(Error DifFusion) method proposed by Stuck.(2) LAT(Local Adaptive Thresholding) for Text document :• use of 5x5 LOCAL WINDOW (TIP ALGORITHM)• ABC(Automatic Background Control) :Tmin Automatic change(3) Mixed mode processing for text/photo mixed document(4) EDF data memory : 2x4Kx16bits = 128Kbits (internal)(5) LAT data memory : 4x4Kx16bits = 256Kbits (external)Scaling of input image(1) Scaling factor• Horizontal direction : 25 ~ 800% by 1% unit• Vertical direction : 25 ~ 100% by 1% unit(2) Scaling data memory : 2x8Kx8bits = 128Kbits (internal)