Contents - Electrical Parts List
- C-CERAMIC, CHIP 0.15nF, 5 %, 50 V, NP0, TP
- Table Of Contents
- C-CERAMIC, CHIP 0.033nF, 5 %, 50 V, NP0,
- C-CERAMIC, CHIP 0.1nF, 5 %, 50 V, NP0,
- C-TA, CHIP 220 uF, 20 %, 6.3 V, LZ, TP,
- exploded view and its parts list
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SAMSUNG Proprietary-Contents may change without notice1-3Electrical Parts List2 GG68-10705A LABEL(P)-SEAL SP-R912, CRP, 65.0x95.0, -, ORG2 GH68-00518A LABEL(P)-SEAL LABEL(VOD) SGH-600, ART PAPER,2 GH68-00619A LABEL(R)-MAIN SGH-A100, MAT, 46.5X36, T0.05, SIL2 GH68-11057A LABEL(P)-MS BAR CODE SCH-1900, ART, 100X155, T0.1,2 GH68-11067A LABEL(P)-BAR CODE SCH-300S, ART, 65X13, 100G, WHT2 GH69-00421A CUSHION-PULP MOLD CASE SGH-A100, -, 186X126X57.52 GH69-00422A CUSHION-PULP MOLD COVER SGH-A100, PULP,2 GH69-00449A BOX(P)-JEWEL PRESS PS -, SGH-A100, PRESS+PS,2 GH69-00470A BOX(P)-CARTON MAIN GERM, SGH-A100, SW3,2 GH69-00472A BOX(P)-UNIT MAIN GERM, SGH-A100, ST240G+E(KOL),2 GH69-30503A BAG-STD BATT. PE, T0.06, 70X170, SCH-10111 GH42-00042A ANT. ANTENNA-SGHA100 SGH-A100, 880-915/925-2 3002-001062 AU1 BUZZER-MAGNETIC 88dB, 3.6 V, 90mA, 2.731KHz, TP1 4302-001081 BACKUP BAT. BATTERY-LI(2ND) -, .25MAH, COIN, 0.03MA, -, -2 4302-001081 BAT1 BATTERY-LI(2ND) -, .25MAH, COIN, 0.03MA, -, -1 GH43-00155A BATT. BATTERY-915M, GLD, ENG, MAIN 3.6 V, 915mA, -, -, -1 GH43-00199A BATT. BATTERY-540M, GLD, ENG, MAIN 3.7 V, 540mAH, -,2 2203-005509 C101 C-CERAMIC, CHIP 330nF, +80-20 %, 10 V, Y5 V, TP, 10052 2404-001105 C102 C-TA, CHIP 10 UF, 20 %, 6.3 V, GP, TP, 20122 2203-000359 C103 C-CERAMIC, CHIP 0.15nF, 5 %, 50 V, NP0, TP, 10052 2203-001432 C104 C-CERAMIC, CHIP 47nF, +80-20 %, 16 V, Y5 V, TP, 10052 2203-005509 C105 C-CERAMIC, CHIP 330nF, +80-20 %, 10 V, Y5 V, TP, 10052 2203-000359 C106 C-CERAMIC, CHIP 0.15nF, 5 %, 50 V, NP0, TP, 10052 2203-001432 C107 C-CERAMIC, CHIP 47nF, +80-20 %, 16 V, Y5 V, TP, 10052 2203-000233 C108 C-CERAMIC, CHIP 0.1nF, 5 %, 50 V, NP0, TP, 10052 2404-001100 C111 C-TA, CHIP 33 uF, 20 %, 6.3 V, GP, TP, 3719, -2 2203-001432 C112 C-CERAMIC, CHIP 47nF, +80-20 %, 16 V, Y5 V, TP, 10052 2203-000278 C113 C-CERAMIC, CHIP 0.01nF, 0.5pF, 50 V, NP0, TP, 10052 2203-005158 C114 C-CERAMIC, CHIP 0.0022nF, 0.25pF, 50 V, NP0, TP, 10052 2203-002443 C115 C-CERAMIC, CHIP 0.33nF, 10 %, 50 V, X7R, TP, 10052 2203-001432 C116 C-CERAMIC, CHIP 47nF, +80-20 %, 16 V, Y5 V, TP, 10052 2203-000330 C117 C-CERAMIC, CHIP 0.012nF, 5 %, 50 V, NP0, TP, 10052 2203-001432 C119 C-CERAMIC, CHIP 47nF, +80-20 %, 16 V, Y5 V, TP, 10052 2203-001432 C122 C-CERAMIC, CHIP 47nF, +80-20 %, 16 V, Y5 V, TP, 10052 2203-001432 C123 C-CERAMIC, CHIP 47nF, +80-20 %, 16 V, Y5 V, TP, 1005Level SEC CODE Design LOC DESCRIPTIONS Remark PreviousNext |