Samsung SGH-E750 Service Manual

Also see for SGH-E750: Service manual User guide

SAMSUNG Proprietary-Contents may change without notice2-2-4. EMI ESD FilterThis system uses the EMI ESD filter, U500 to protect noise from IF CONNECTOR part.2-2-5. IF connetorIt is 18-pin connector. They are designed to use VBAT, V_EXT_CHARGE, USB_D+, +VBUS, USB_D-, TXD1, RXD1,AUX_ON, EXT1, EXT2 and GND. They connected to power supply IC, microprocessor and signal processor IC.2-2-6. Battery Charge ManagementA complete constant-current/constant-voltage linear charger for single cell lithium-ion batteries.If TA connected to phone, "V_EXT_CHARGE" enable charger IC and supply current to battery.When fault condition caused, "CHG_ON" signal level change low to high and charger IC stop charging process.2-2-7. AudioHFR_P and HFR_N from PCF5213EL1 are connected to the main speaker via analog switches. MIC_P and MIC_Nare connected to the main MIC as well. YMU765 is a synthesizer LSI for mobile phones. This LSI has a built-in speakeramplifier for outputting sounds that are used by mobile phones in addition to game sounds and ringing melodies that arereplayed by a synthesizer.There is Stereophonic analog output for Headphone.2-2-8. MemoryThis system uses Samsung's memory, . The . is a Multi Chip PackageMemory whichcombines 256Mbit Synchronous Burst Multi Bank NOR Flash Memory and 1Gbit NANDFlash and 128Mbit Synchronous Burst U tRAM.It has 16 bit data line, HD[1~16] which is connected to PCF5213 and MV3315DOQ, also has 24 bit address lines,HA[1~24]. There are 3 chip select signals, CS0n_FLASH, CS4n_NAND, and CS1n_RAM.In the Wrting process, WEn is fallen to low and it enables writing process to operate. During reading process,OEn is fallen to low and it enables reading process to operate. Each chip select signals in the PCF5213EL1 choosedifferent memories.2-2-9. PCF5213EL1The PCF5213EL1 is mainly composed of embeded DSP and ARM core. The DSP subsystem includes the SaturnDSP core with embedded RAM and ROM, and a set of peripherals. It has 24kx16 bits PRAM, 104k*16 bits,32k*16 XYRAM and 63k*16 XYROM in the DSP.The ARM946E-S consists of an ARM9E-S processor core, 8 kbyte instruction cache and 8 kbyte data cache,tghtly-coupled ITCM(Instruction Tightly Coupled Memory) and DTCM(Data Tightly Coupled Memory) memories, amemory protection unit, and an AMBA(Advanced Microcontroller Bus Architecture) AHB(AdvancedHigh-performance Bus) bus interface with a write buffer.HD(0:15), data lines and HA(0:23), address lines are connected to KBJ10KB00M (memory), MV319DNQ (image dsp)and YMU765 (melody IC). It has 64 kbyte SC RAM (0.5 Mbit) and 32 kbyte SC program ROM for bootstraploader in the ARM core.Downloaded from www.Manualslib.com manuals search engine