185.3 Wrapping a heat shrinkable sleeve around the head piece / connectionelementApplying heat shrinkable sleevesAfter mounting the head piece / connection element to the HVI ®power Conductor, a heat shrinkablesleeve must be wrapped around the relevant mounting areas to protect them from mechanical, en-vironmental or chemical influences. The connection set includes two heat shrinkable sleeves.The following must be observed when wrapping a heat shrinkable sleeve around the headpiece / connection element: The indicated shrinking area between the head piece / connection element and theHVI®power Conductor must be observed (Fig. 4). The heat shrinkable sleeve is applied between the front shrinking area of the relevant head piece /connection element and the HVI®power Conductor. The heat shrinkable sleeves must flush withthe shrinking area. If required, they must be repositioned during the shrinking on process. The specified shrinking temperature of max. 150 °C must be observed! The shrinking temperatures in the shrinking area of the HVI ®power Conductor must not be toohigh. In case of excessive shrinking temperatures, the semiconductive sheath of the HVI ®powerConductor can be damaged or destroyed and the function of the HVI®power Conductor may notbe ensured any more. The heat shrinkable sleeve must not trap air or form bubbles!Figure 4 Wrapping around a heat shrinkable sleeve around the head piece / connection elementShrinking area of thehead pieceShrinking area of theconnection element Shrinking area of theconnection elementIncorrect shrinkingCorrect shrinking