ADL Embedded Solutions ADLQM67PC Manual
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Contents
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Chapter: Technical Data Thermal Specificationspage 80 ADL Embedded Solutions ADLQM67PC7.3 Thermal SpecificationsThe board is specified to operate in an environmental temperature range from -25°C to +70°C when usingan approved thermal solution, and an extended temperature range of -40°C to +85°C when pre-screenedfor use with an approved thermal solution.Maximum die temperature is 100°C. To keep the processor under this threshold an appropriate coolingsolution needs to be applied. This solution has to take typical and maximum power consumption intoaccount. The maximum power consumption may be twice as high and should be used as a basis for thecooling concept. Additional controllers may also affect the cooling concept. The power consumption ofsuch components may be comparable to the consumption of the processor.The board design includes thermal solution mounting points that will provide the best possible thermalinterface between die and solution. Since we take thermal solutions seriously we have several advanced,aggressive cooling solutions in our product portfolio. Please contact your sales representative to order ordiscuss your thermal solution needs.CAUTIONThe end customer has the responsibility to ensure that the die temperature of the processor does notexceed 100°C. Permanent overheating may destroy the board!In case the temperature exceeds 100°C the environmental temperature must be reduced. Under certaincircumstances sufficient air circulation must be provided.CAUTIONThe ADLQM67PC includes circuitry that will notify an intelligent power supply to shut down if theprocessor reaches a critical temperature. This is achieved by deasserting the (low-active) PS_ON# signalfound on the SM-Bus connector. When PS_ON# is no longer pulled low, an intelligent power supplywould take this as a signal to shut down power. For this to work, PS_ON# must be connected to thepower supply's PS_ON input. If PS_ON# is not otherwise connected, the ADLQM67PC can be damagedbeyond repair if a thermal shutdown event occurs. In rare instances, if power is not shut down, the boardwill continue to heat up until failure occurs. |
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