Canon EOS 1Ds Mark III White Paper

Also see for EOS 1D Mark III: Instruction manual Product guide Instruction manual Product guide Instruction manual

Canon EOS 1Ds Mark III White Paper Manual pdf 16 page image

UDMA (Ultra Direct Memory Access) is a new specification for CF cards (Compact FlashSpecification Revision 4.0) to enable high-speed writing to the card. With a UDMA-com-pliant CF card, the data transfer speed is twice as fast as with the EOS-1D Mark III, andthe writing speed is on par with the EOS-1D Mark III (and about 3 times as fast as theEOS-1Ds Mark II) even though the pixel count is twice as large.With a higher number of pixels in the same sensor dimensions, the pixel size is neces-sarily smaller than those of the EOS-1Ds Mark II. Nevertheless, the ISO speed range isthe same as that of the EOS-1Ds Mark II with ISO 100 to 1600 and ISO extensions of 50(L) and 3200 (H).* The ISO speed Safety Shift is enabled via C.Fn I-8-2. The ISO speedcontrol value differs from that of the EOS-1D Mark III. Note that the maximum burst dur-ing continuous shooting will decrease if ISO speed safety shift, noise reduction for highISO speeds (C.Fn II -2-1), or a high ISO speed is set. (The maximum burst during contin-uous shooting is displayed in the viewfinder.)*Standard output sensitivity. Recommended exposure index.The EOS-1Ds Mark III uses the EOS Integrated Cleaning System, a complete dust reduc-tion system for reducing dust adhering to the imaging sensor, removing dust, and mak-ing dust spots less noticeable. The Self Cleaning Sensor Unit is a newly designed, dedi-cated unit optimized for the full-frame CMOS sensor. As with the EOS-1D Mark III, thisunit has two thin piezoelectric elements that apply ultrasonic vibration to shake dust offthe infrared absorption glass which is the outermost layer in front of the low-pass filter.The removed dust then sticks to the absorbent material lining the perimeter of theinfrared absorption glass. Mechanisms such as the shutter and the mirror are manufac-tured in ways that reduce the generation of dust. The LPF uses grounding and a conduc-tion process to discharge static electricity, minimizing dust adherence. And, to preventthe dust from entering the internal parts, the unit’s outer periphery is sealed. The speci-fications of the unit’s operating condition, forced termination condition, and Dust DeleteData acquisition and application are the same as with the EOS-1D Mark III.As with the EOS-1D Mark III, 6 drive modes (single shooting, high-speed continuous,low-speed continuous, 10-sec. self-timer, 2-sec. self-timer, and silent single shooting)are provided. The noise level of the single shooting and silent single shooting modes isthe same as with the EOS-1D Mark III.IV. DISCUSSION OF NEW AND IMPROVED FEATURES 16New UDMA CompatibilityISO SpeedEOS Integrated CleaningSystemDrivePiezoelectric elementSupport materialLow-pass filterCMOS sensorInfrared-absorptionglassSealing materialSelf Cleaning Sensor Unit Construction Diagram Absorbent Material