H3C S5830V2 Series Installation Manual

Also see for S5820V2 series: Configuration guide Security configuration guide Command reference Command reference MCE Command Reference

Contents

H3C S5830V2 Series Installation Manual Manual pdf 9 page image

2For the temperature and humidity requirements of different switch models, see "Appendix A Chassisviews and technical specifications."CleanlinessDust buildup on the chassis might result in electrostatic adsorption, which causes poor contact ofmetal components and contact points, especially when indoor relative humidity is low. In the worstcase, electrostatic adsorption can cause communication failure.Table 1 Dust concentration limit in the equipment roomSubstance Concentration limit (particles/m3)Dust ≤ 3 x 104 (no visible dust on the tabletop over three days)NOTE:Dust diameter ≥ 5 μmThe equipment room must also meet limits on salts, acids, and sulfides to eliminate corrosion andpremature aging of components, as shown in Table 2.Table 2 Harmful gas limits in the equipment roomGas Maximum concentration (mg/m3)SO 2 0.2H2 S 0.006NH3 0.05Cl2 0.01EMIAll electromagnetic interference (EMI) sources, from outside or inside of the switch and applicationsystem, adversely affect the switch in the following ways:• A conduction pattern of capacitance coupling.• Inductance coupling.• Electromagnetic wave radiation.• Common impedance (including the grounding system) coupling.To prevent EMI, use the following guidelines:• If AC power is used, use a single-phase three-wire power receptacle with protection earth (PE)to filter interference from the power grid.• Keep the switch far away from radio transmitting stations, radar stations, and high-frequencydevices.• Use electromagnetic shielding, for example, shielded interface cables, when necessary.Laser safetyWARNING!Do not stare into any fiber port when the switch has power. The laser light emitted from the opticalfiber might hurt your eyes.