ECW-281B-BTi Embedded SystemPage vTable of Contents1 INTRODUCTION.......................................................................................................... 11.1 OVERVIEW .................................................................................................................. 21.2 BENEFITS ................................................................................................................... 21.3 FEATURES ................................................................................................................... 31.4 M ODEL VARIATIONS ................................................................................................... 31.5 EXTERNAL OVERVIEW ................................................................................................ 41.5.1 Front Panel ........................................................................................................ 41.5.2 Rear Panel ......................................................................................................... 51.5.3 Bottom Surface................................................................................................... 61.6 I NTERNAL OVERVIEW ................................................................................................. 71.7 TECHNICAL SPECIFICATIONS ...................................................................................... 81.8 POWER M ODULE SPECIFICATIONS (OPTIONAL ) ........................................................ 101.9 DIMENSIONS ..............................................................................................................112 UNPACKING ............................................................................................................... 122.1 UNPACKING .............................................................................................................. 132.2 PACKING LIST ........................................................................................................... 132.3 OPTIONAL I TEMS ...................................................................................................... 143 INSTALLATION ......................................................................................................... 153.1 ANTI - STATIC PRECAUTIONS ...................................................................................... 163.2 I NSTALLATION PRECAUTIONS ................................................................................... 163.2.1 High Surface Temperature ............................................................................... 173.3 I NSTALLATION PROCEDURE ...................................................................................... 183.4 BOTTOM SURFACE REMOVAL ................................................................................... 183.5 CONFIGURE THE J UMPER SETTINGS .......................................................................... 193.5.1 Clear CMOS..................................................................................................... 193.5.2 AT/ATX Mode Selection ................................................................................... 203.6 HARD D RIVE I NSTALLATION ..................................................................................... 213.7 FULL - SIZE PCI E MINI/ MSATA C ARD I NSTALLATION ................................................ 243.8 HALF - SIZE PCI E M INI CARD I NSTALLATION ............................................................. 26