Madell Technology, Corporate Office, 1141 E Philadelphia Street, Ontario, CA 91761t. 877-670-9023 f. 909-418-6956Website: www.madelltech.com; Technical Service Email: info@madelltech.com16Madell Technology, Corp.4.5 Description of Temperature CurveThe control of temperature curve is critical to ensure soldering quality. The temperature curve issoldering past melting curve, which consists of five processes: temperature rising process →temperature keeping process → rapid temperature rising process → soldering process → coolingprocess. Here is an example of temperature curve for leaded soldering: the temperature risingprocess is from room temperature to 145°C, and the heating unit is heating; 145°C - 160°C istemperature keeping phase, at which the soldering flux in the soldering paste volatilizes fully, and atwhich the heating tube conducts adjustment according to the situation whether there is a differencebetween the set temperature and the actual temperature or not and flickering occurs; when thetemperature reaches more than 183°C, the soldering paste melts; the temperature rises continuouslyand soldering is conducted; after the soldering is completed, the air cooling process is carried out.Thus, a complete soldering process is over.The bases to set the temperature curve of the reflow soldering machine:A. Set the temperature curve of the reflow soldering machine according to the temperature curveof soldering paste. The temperature curve of soldering paste varies with the metal contents,so the temperature curve of the reflow soldering machine for specific product shall be setaccording to the temperature curve of soldering paste provided by the soldering pastesupplier.B. Set different temperature curve based on the material, thickness, layers and size of PCB. IfPCBs are aluminum based boards, the temperature shall be set a little higher (adjusted up by30±10°C according to the size and quantity of PCBs); for thin PCBs (especially less than1.2mm), the temperature shall be set a little lower.C. Set the temperature curve based on the density, size and color of components mounted onPCB and based on the situation if there are special components on PCB, such as BGA, CSPetc.D. The reflow soldering machine is a flash heating system, so there is difference between