N21Hardware User GuideCopyright © Neoway Technology Co., Ltd. All rights reserved. 337.5 SMT ProfileThin or long PCB might bend during SMT. So, use loading tools during the SMT and reflow solderingprocess to avoid poor solder joint caused by PCB bending.Figure 7-3 SMT furnace temperature curveTechnical parameters: Ramp up rate: 1 to 4 °C/secRamp down rate: -3 to -1 °C/sec Soaking zone: 150-180 °C, Time: 60-100 s Reflow zone: >220 °C, Time: 40-90 s Peak temperature: 235-250 °CNeoway will not provide warranty for heat-responsive element abnormalities caused by impropertemperature control.For information about cautions in N21 storage and mounting, refer to Neoway Module ReflowManufacturing Recommendations.When manually desoldering the module, use heat guns with great opening, adjust the temperature to250 degrees (depending on the type of the solder paste), and heat the module till the solder paste ismelt. Then remove the module using tweezers. Do not shake the module in high temperatures whileremoving it. Otherwise, the components inside the module might get misplaced.