Panasonic GSM EB-A100 Service Manual

– 7-1 –7. REPAIR PROCEDURES7.1. IntroductionThis section provides information on testing the telephone. Thelayout is as follows:7.2. Lead Free (PbF) solder7.3. External Testing7.3.1. General InformationThe handset can be connected to a compatible personal computer for electronic adjustment and fault diagnosis. This sectionprovides a description of the equipment required to perform those tasks.Prior to testing and adjustment, the unit should first be disassembled, as detailed in Section 6, and then the PCB connected tothe PCB Repair Jig. Fault tracing can be performed on the PCB using suitable test equipment, such as spectrum analysersand oscilloscope.The unit must be tested and calibrated for all frequency bands (900 MHz and 1900 MHz).Section 7.2. : Lead Free (PbF) solder: Identification and repair of PCBs using PbF solder.Section 7.3. : External testing: describes equipment requirements and general set up procedure.Section 7.4. : Complete Unit Test Setup: Describes how the items of test equipment are used together and general set upprocedure.Adjustment Procedure are described in Section 8.CAUTIONThe Printed Circuit Board (PCB) used in this telephone has been manufactured using Lead Free solder.(SPARKLE ECO SOLDE : Part No. ESC F3 M705 0.3)Lead Free solder has a higher melting point than Lead solder - typically 30 - 40 °C higher. Always use a high temperature soldering ironWhen using a soldering iron with temperature control, it should be set to 370 ± 10 °C (700 ± 20 °F).When using lead solder, all PbF solder must be removed from the solder area. Where this is not possible, heat the PbF solder until itmelts before applying lead solder.Avoid over heating PbF solder as it has a tendency to splash at temperatures above 600 °C (1100 °F).Personal Computer (PC)The PC (IBM compatible) is used as a Unit Under Test controller.Power SupplyProvides 3.8 V DC supply to RF Adaptor and PCB Repair Jig.