u-blox EVA-8M Series Hardware Integration Manual

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u-blox EVA-8M Series Hardware Integration Manual Manual pdf 31 page image

EVA-8M and EVA-M8 series - Hardware Integration ManualUBX-16010593 - R06 Product handling & soldering Page 31 of 47Early Production InformationThe paste-mask geometry for applying soldering paste should meet the recommendations given insection 2.11.2.3.3.2 Reflow solderingCondition Abbreviation RecommendationPreheat/ Soak Temperature min.Preheat/ Soak Temperature max.Preheat/ Soak Time from Tsmin to TsmaxTsminTsmaxTs (Tsmin to Tsmax )150°C180°C< 90 secondsLiquidus TemperatureTime maintained above TLTLt L217°C40 to 60 secondsPeak Package Body Temperature TP 250°CRamp up rate (TL to T P) 3°C/ second max.Time within +0°C…-5°C of TP 30 secondsRamp down rate (TP to TL ) 4°C/ second max.Table 9: Recommended conditions for reflow processThe peak temperature must not exceed 250°C. The time above 245°C must not exceed 30 seconds.☞ EVA-8M / EVA-M8 series GNSS modules must not be soldered with a damp heat process.3.3.3 Optical inspectionAfter soldering the modules, consider an optical inspection step to check whether:• The module is properly aligned and centered over the pads3.3.4 Repeated reflow solderingOnly single reflow soldering process is recommended for boards populated with EVA-8M / EVA-M8series GNSS modules.3.3.5 Wave solderingBase boards with combined through-hole technology (THT) components and surface-mounttechnology (SMT) devices require wave soldering to solder the THT components. Only a single wavesoldering process is encouraged for boards populated with EVA-8M / EVA-M8 series GNSS modules.3.3.6 ReworkNot recommended.3.3.7 Use of ultrasonic processesSome components on the EVA-8M / EVA-M8 series GNSS modules are sensitive to Ultrasonic Waves.Use of any Ultrasonic Processes (cleaning, welding etc.) may cause damage to the GNSS Receiver.☞ u-blox offers no warranty against damages to the EVA-8M / EVA-M8 series GNSS modules causedby any Ultrasonic Processes.