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u-blox EVA-8M Series Hardware Integration Manual

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Contents
  1. Document Information
  2. Table Of Contents
  3. Table Of Contents
  4. Table Of Contents
  5. Hardware description
  6. Design-in
  7. Power management configuration
  8. Interfaces
  9. Display Data Channel (DDC) Interface
  10. SQI Flash memory
  11. I/O Pins
  12. External interrupt
  13. Electromagnetic interference and I/O lines
  14. Real-Time Clock (RTC)
  15. Time aiding
  16. Improved Jamming Immunity
  17. System Reset (RESET_N)
  18. Pin description
  19. Pin name changes
  20. Layout
  21. Placement
  22. C88-M8M - Evaluating EVA-M8M on existing NEO-xM sockets
  23. EOS/ESD/EMI precautions
  24. Electrostatic Discharge (ESD)
  25. Electromagnetic interference (EMI)
  26. Product handling & soldering
  27. Reflow soldering
  28. Product testing
  29. Appendix
  30. A.2 Best performance circuit with passive antenna
  31. A.3 Improved jamming immunity with passive antenna
  32. A.4 Circuit using active antenna
  33. A.5 USB self-powered circuit with passive antenna
  34. A.6 USB bus-powered circuit with passive antenna
  35. A.7 Circuit using 2-pin antenna supervisor
  36. A.8 Circuit using 3-pin antenna supervisor
  37. B Component selection
  38. B.3 External LNA protection filter (F2)
  39. B.7 Optional SQI Flash (U3)
  40. B.11 Antenna supervisor switch transistor (T1)
  41. B.16 Standard resistors
  42. Related documents
  43. Contact
u-blox EVA-8M Series Hardware Integration Manual Manual pdf 4 page image
EVA-8M and EVA-M8 series - Hardware Integration ManualUBX-16010593 - R06 Page 4 of 47Early Production Information2.12 Migration considerations ........................................................................................................................222.12.1 Hardware migration from EVA-7M to EVA-8M / EVA-M8M / EVA-M8Q ..............................222.12.2 C88-M8M - Evaluating EVA-M8M on existing NEO-xM sockets ............................................242.13 EOS/ESD/EMI precautions ......................................................................................................................252.13.1 Electrostatic Discharge (ESD) .......................................................................................................262.13.2 ESD protection measures ...............................................................................................................262.13.3 Electrical Overstress (EOS) ............................................................................................................262.13.4 EOS protection measures ...............................................................................................................262.13.5 Electromagnetic interference (EMI) .............................................................................................272.13.6 Applications with cellular modules ...............................................................................................273 Product handling & soldering.......................................................................................................... 303.1 Packaging, shipping, storage and moisture preconditioning ..........................................................303.2 ESD handling precautions .......................................................................................................................303.3 Soldering .....................................................................................................................................................303.3.1 Soldering paste .................................................................................................................................303.3.2 Reflow soldering ................................................................................................................................313.3.3 Optical inspection .............................................................................................................................313.3.4 Repeated reflow soldering ..............................................................................................................313.3.5 Wave soldering ..................................................................................................................................313.3.6 Rework ................................................................................................................................................313.3.7 Use of ultrasonic processes ...........................................................................................................314 Product testing ................................................................................................................................... 324.1 Test parameters for OEM manufacturer .............................................................................................324.2 System sensitivity test ............................................................................................................................324.2.1 Guidelines for sensitivity tests ......................................................................................................324.2.2 ‘Go/No go’ tests for integrated devices ........................................................................................32Appendix ....................................................................................................................................................... 33A Reference schematics....................................................................................................................... 33A.1 Cost optimized circuit ..............................................................................................................................33A.2 Best performance circuit with passive antenna .................................................................................34A.3 Improved jamming immunity with passive antenna .........................................................................35A.4 Circuit using active antenna ...................................................................................................................36A.5 USB self-powered circuit with passive antenna .................................................................................37A.6 USB bus-powered circuit with passive antenna .................................................................................38A.7 Circuit using 2-pin antenna supervisor ................................................................................................39A.8 Circuit using 3-pin antenna supervisor ................................................................................................40B Component selection ........................................................................................................................ 41B.1 External RTC (Y1) ......................................................................................................................................41B.2 RF band-pass filter (F1) ...........................................................................................................................41B.3 External LNA protection filter (F2) ........................................................................................................42B.4 USB line protection (D2) ..........................................................................................................................42B.5 USB LDO (U1) .............................................................................................................................................42
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This manual is suitable for:
EVA-8MEVA-8M SeriesEVA-M8 SeriesEVA-M8MEVA-M8Q
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