Error! No text of specified style in document. - System Integration ManualCDMA-2X-11004-P1 Objective Specification Design-InPage 72 of 7975 Reference 76 Description 77 Remarks87 Rint 88 10 kΩ Resistor 0402 5% 0.1 W 89 Internal pull-up resistorTable 21: Example of components as ESD immunity test precautions for the HW_SHUTDOWN lineSIM interfaceSensitive interface is the SIM interface (VSIM pin, SIM_RST pin, SIM_IO pin, SIM_CLK pin): A 47 pF bypass capacitor (e.g. Murata GRM1555C1H470J) have to be mounted on the linesconnected to VSIM, SIM_RST, SIM_IO and SIM_CLK to assure SIM interface functionality when anelectrostatic discharge is applied to the application board enclosure It is suggested to use as short as possible connection lines at SIM pins89.1.1 Antenna interface precautionsThe antenna interface ANT can have a critical influence on the ESD immunity test depending onthe application board handling. Antenna precaution suggestions are provided: If the device implements an embedded antenna and the device insulating enclosure avoids airdischarge up to +8 kV / -8 kV to the antenna interface, no further precautions to ESD immunitytest should be needed If the device implements an external antenna and the antenna and its connecting cable areprovided with a completely insulating enclosure to avoid air discharge up to +8 kV / -8 kV to thewhole antenna and cable surfaces, no further precautions to ESD immunity test should beneeded If the device implements an external antenna and the antenna or its connecting cable are notprovided with completely insulating enclosure to avoid air discharge up to +8 kV / -8 kV to thewhole antenna and cable surfaces, the following precautions to ESD immunity test should beimplemented on the application boardA higher protection level is required at the ANT port if the line is externally accessible on theapplication board. ESD immunity test requires protection up to +4 kV / -4 kV for direct ContactDischarge and up to +8 kV / -8 kV for Air Discharge applied to the antenna port.89.1.2 Module interfaces precautionsAll the module pins that are externally accessible should be included in the ESD immunity test sincethey are considered to be a port as defined in [13]. Depending on applicability, and in order tosatisfy ESD immunity test requirements and ESD category level, pins connected to the port shouldbe protected up to +4 kV / -4 kV for direct Contact Discharge, and up to +8 kV / -8 kV for AirDischarge applied to the enclosure surface.The maximum ESD sensitivity rating of all the pins of the module, except the ANT pin, is 1 kV (HumanBody Model according to JESD22-A114F). A higher protection level can be achieved by mountingan ESD protection (e.g. EPCOS CA05P4S14THSG varistor array or CT0402S14AHSG).For the USB interface a very low capacitance (i.e. less or equal to 1 pF) ESD protection (e.g. TycoElectronics PESD0402-140 ESD protection device) can be mounted on the lines connected toUSB_D+ and USB_D- pins.For the SIM interface a low capacitance (i.e. less than 10 pF) ESD protection (e.g. InfineonESD8V0L2B-03L or AVX USB0002) must be placed near the SIM card holder on each line (VSIM,SIM_IO, SIM_CLK, SIM_RST).Comment [rjc6]: I need to check thesecontact numbers