u-blox NINA-B112 System Integration Manual

Also see for NINA-B111: Manual Getting started

u-blox NINA-B112 System Integration Manual Manual pdf 40 page image

NINA-B1 series - System Integration ManualUBX-15026175 - R09 Handling and solderingPage 40 of 49• Cleaning with alcohol or other organic solvents can result in soldering flux residues flooding into thetwo housings, areas that are not accessible for post-wash inspections. The solvent will also damage thesticker and the ink-jet printed text.• Ultrasonic cleaning will permanently damage the module, in particular the crystal oscillators.For best results use a "no clean" soldering paste and eliminate the cleaning step after the soldering process.4.3.3 Other remarks• Only a single reflow soldering process is allowed for boards with a module populated on it.• Boards with combined through-hole technology (THT) components and surface-mount technology(SMT) devices may require wave soldering to solder the THT components. Only a single wave solderingprocess is allowed for boards populated with the modules. Miniature Wave Selective Solder process ispreferred over traditional wave soldering process.• Hand soldering is not recommended.• Rework is not recommended.• Conformal coating may affect the performance of the module, it is important to prevent the liquid fromflowing into the module. The RF shields do not provide protection for the module from coating liquidswith low viscosity, therefore care is required in applying the coating. Conformal coating of the modulewill void the warranty.• Grounding metal covers: attempts to improve grounding by soldering ground cables, wick or otherforms of metal strips directly onto the EMI covers is done at the customer's own risk and will voidmodule’s warranty. The numerous ground pins are adequate to provide optimal immunity tointerferences.• The module contains components that are sensitive to Ultrasonic Waves. Use of any ultrasonic processessuch as cleaning, welding etc., may damage the module. Use of ultrasonic processes on an end productintegrating this module will void the warranty.