18 Chapter 1Hardware Specifications and ConfigurationsProcessorNorth BridgeItem SpecificationCPU AMD CPU S1g2 Processor (Griffin Series - Turion / Sempron);HT3 (1.2~2.6 GT/s) (Bandwidth: 9.6GB/S to 20.8GB/s)Type 1.8GHZ~2.3GHZCPU package AMD 638 pin Micro-PGAFeatures • Hyper Transport 3.0 Technology: Designed to support HTGen3 speeds from 1.2GHZ to 2.6GHZ.• 64-bit or 128-bit DDR2 Memory Interface: Two independent64-bit DDR2 channels.• Split Power Planes: Separate power planes provided for eachCPU core and on die Northbridge• Up to 2 processor cores per die, Up to 1MB L2 cache per die.• Each CPU core supports up to 8 P-states: P0 (Highestperformance) and P7CPU Power • VDD0, VDD1 set according to the respective P-state controlwhen core VDD are isolated and VDD set according to theCPU core in the highest performance P-state when VDD iscommon.• CPU_VDDNB; VLDT 1.2V_HT; VDD I/O 1.8VSUS; CPUMemory InterfaceItem SpecificationType AMD RS780M (North Bridge)Package FCBGA 528-pinFeatures • CPU Hyper Transport Interface: Support 16-bit up/down HyperTransport 3.0 interface up to 5.2GT/S.• PCI Express Interface: Support PCI-E GEN2; Optimized peerto peer and general purpose link performance; Highly flexiblePCI Express implementation to suit a variety of platform needs.• A-Link Express II interface: one x4 A-Link Express II Interfacefor connectionPower 1.1V, 1.2V, 1.8V, 3.3V
