DellDell PowerEdge R910 Technical Guide 3Table of Contents1 Product Comparison ........................................................................................... 71.1 Overview of PowerEdge R910 Benefits ................................................................ 71.2 Comparison of PowerEdge R910 to PowerEdge R900................................................ 82 New Technologies ............................................................................................ 102.1 Overview ................................................................................................ 102.2 Detailed Information .................................................................................. 102.2.1 Intel Xeon Processor 7500 Series ............................................................... 102.2.2 Internal Dual SD Module (IDSM) ................................................................ 112.2.3 10Gb Embedded NIC ............................................................................. 113 System Information .......................................................................................... 124 Mechanical .................................................................................................... 154.1 Chassis Description..................................................................................... 154.2 Dimensions and Weight ................................................................................ 164.3 Front Panel View and Features ...................................................................... 174.4 Back Panel View and Features ....................................................................... 194.5 Power Supply Indicators ............................................................................... 204.6 NIC Indicators ........................................................................................... 204.7 Internal Chassis View .................................................................................. 214.8 Rails and Cable Management ......................................................................... 214.9 Fans ...................................................................................................... 214.10 Cabling ................................................................................................... 234.11 Security .................................................................................................. 244.11.1 Cover Latch ....................................................................................... 244.11.2 Bezel ............................................................................................... 244.11.3 Hard Drive ......................................................................................... 254.11.4 Trusted Platform Module (TPM) ................................................................ 254.11.5 Power Off Security ............................................................................... 254.11.6 Intrusion Alert .................................................................................... 254.11.7 Secure Mode ...................................................................................... 254.12 USB Key .................................................................................................. 254.13 Battery ................................................................................................... 264.14 Field Replaceable Units (FRU)........................................................................ 274.15 User Accessible Jumpers, Sockets, and Connectors ............................................... 275 Electrical ...................................................................................................... 285.1 Clock Circuitry .......................................................................................... 286 Power, Thermal, Acoustic .................................................................................. 296.1 Power Supplies and Power Subsystem .............................................................. 296.2 Environmental Specifications......................................................................... 316.3 Thermal.................................................................................................. 316.4 Acoustics ................................................................................................ 327 Processors ..................................................................................................... 357.1 Overview ................................................................................................ 35