H3C S6300 Installation Manual
Also see for S6300 Series: Evb configuration guideTroubleshooting guideConfiguration ExamplesInstallation, quick startConfiguration guide
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Contents
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2For the temperature and humidity requirements of different switch models, see "Technicalspecifications."CleanlinessDust buildup on the chassis might result in electrostatic adsorption, which causes poor contact ofmetal components and contact points, especially when indoor relative humidity is low. In the worstcase, electrostatic adsorption can cause communication failure.Table 1 Dust concentration limit in the equipment roomSubstance Concentration limit (particles/m³)Dust ≤ 3 x 104 (no visible dust on the tabletop over three days)NOTE:Dust diameter ≥ 5 μmThe equipment room must also meet limits on salts, acids, and sulfides to eliminate corrosion andpremature aging of components, as shown in Table 2.Table 2 Harmful gas limits in the equipment roomGas Maximum concentration (mg/m 3)SO 2 0.2H2 S 0.006NH3 0.05Cl2 0.01EMIElectromagnetic interference (EMI) might be coupled from the source to the switch through thefollowing coupling mechanisms:• Capacitive coupling• Inductive coupling• Radiative coupling• Common impedance coupling• Conductive couplingTo prevent EMI, use the following guidelines:• If AC power is used, use a single-phase three-wire power receptacle with protection earth (PE)to filter interference from the power grid.• Keep the switch far away from radio transmitting stations, radar stations, and high-frequencydevices.• Use electromagnetic shielding, for example, shielded interface cables, when necessary.• To prevent signal ports from getting damaged by overvoltage or overcurrent caused by lightningstrikes, route interface cables only indoors. |
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