IMB-H810-i2 microATX MotherboardPage 148DIMM Dual Inline Memory Modules are a type of RAM that offer a 64-bit databus and have separate electrical contacts on each side of the module.DIO The digital inputs and digital outputs are general control signals thatcontrol the on/off circuit of external devices or TTL devices. Data can beread or written to the selected address to enable the DIO functions.EHCI The Enhanced Host Controller Interface (EHCI) specification is aregister-level interface description for USB 2.0 Host Controllers.EIDE Enhanced IDE (EIDE) is a newer IDE interface standard that has datatransfer rates between 4.0 MBps and 16.6 MBps.EIST Enhanced Intel® SpeedStep Technology (EIST) allows users to modifythe power consumption levels and processor performance throughapplication software. The application software changes the bus-to-corefrequency ratio and the processor core voltage.FSB The Front Side Bus (FSB) is the bi-directional communication channelbetween the processor and the Northbridge chipset.GbE Gigabit Ethernet (GbE) is an Ethernet version that transfers data at 1.0Gbps and complies with the IEEE 802.3-2005 standard.GPIO General purpose inputHDD Hard disk drive (HDD) is a type of magnetic, non-volatile computerstorage device that stores digitally encoded data.ICH The Input/Output Control Hub (ICH) is an Intel® Southbridge chipset.IrDA Infrared Data Association (IrDA) specify infrared data transmissionprotocols used to enable electronic devices to wirelessly communicatewith each other.L1 Cache The Level 1 Cache (L1 Cache) is a small memory cache built into thesystem processor.L2 Cache The Level 2 Cache (L2 Cache) is an external processor memory cache.LCD Liquid crystal display (LCD) is a flat, low-power display device thatconsists of two polarizing plates with a liquid crystal panel in between.
