Contentsvi | ni.comChapter 2User-Defined FPGA SignalsSecondary Ethernet (GBE1) ............................................................................................. 2-1GBE1 Signal Definitions on the Reference Carrier Board ....................................... 2-2GBE1 Reference Schematic...................................................................................... 2-4GBE1 Routing Considerations.................................................................................. 2-8Additional RS-232 (Serial2, Serial3, Serial4) .................................................................. 2-9Serial2 Signal Definitions on the Reference Carrier Board...................................... 2-9Serial2 Reference Schematic .................................................................................... 2-10RS-485 (Serial5, Serial6).................................................................................................. 2-11Serial5 Definitions on the Reference Carrier Board ................................................. 2-12Serial5 Reference Schematic .................................................................................... 2-13RS-485 Layout Considerations ................................................................................. 2-14CAN (CAN0, CAN1) ....................................................................................................... 2-14CAN0 Signal Definitions on the Reference Carrier Board....................................... 2-15CAN0 Reference Schematic ..................................................................................... 2-16Termination Resistors for CAN Cables .................................................................... 2-18Chapter 3Carrier Board PCB Layout GuidelinesImpedance-Controlled Signaling ...................................................................................... 3-1Single-Ended Signal Best Practices .................................................................................. 3-2Differential Signal Best Practices ..................................................................................... 3-2Ground and Power Plane Recommendations.................................................................... 3-3Fanout and Layout Options............................................................................................... 3-3Chapter 4Mechanical ConsiderationsMounting........................................................................................................................... 4-1Selecting an Appropriate Mating Connector ............................................................ 4-1Selecting Appropriate Standoffs ............................................................................... 4-2Mounting Direction Options..................................................................................... 4-4Managing Thermal Conditions ......................................................................................... 4-6Designing a Suitable Enclosure ................................................................................ 4-6Understanding Thermal Specifications..................................................................... 4-7Validating the System ....................................................................................................... 4-8Validating Temperature Measurements.................................................................... 4-8Managing Power and Feature Utilization ................................................................. 4-10Mounting Recommendations for Maximizing Thermal Performance......................4-11Additional Resources for Managing Thermal Conditions ........................................ 4-12Shock and Vibration ......................................................................................................... 4-12