National Instruments sbRIO-9651 Design Manual

Also see for sbRIO-9651: Quick start guide

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National Instruments sbRIO-9651 Design Manual Manual pdf 65 page image

© National Instruments | 4-11NI sbRIO-9651 System on Module Carrier Board Design GuideMounting Recommendations for Maximizing ThermalPerformanceThe sbRIO-9651 SOM includes an integrated heat spreader that uses a thermal gap filler materialto effectively conduct into the spreader the heat that the circuit card assembly componentsgenerate. NI recommends the following mounting procedures for maximizing the thermalperformance of your application:• Directly mount the flat and smooth exterior surface of the integrated heat spreader toa thermally-conductive surface, such as a metal enclosure wall or plate, as shown inFigure 4-1. An interface material such as thermal grease should be used to maximize theheat transfer from the integrated heat spreader to the enclosure or plate. The enclosure orplate conducts and convects the heat to the external ambient environment.If design limitations prevent this solution, you can alternatively attach a heat sink or otherthermal solution to the integrated heat spreader, as shown in Figure 4-3. This solution takesadvantage of natural convection or forced convection cooling provided by a fan.• Mount the sbRIO-9651 SOM vertically with respect gravity to take advantage of naturalconvection cooling.• Mount the sbRIO-9651 SOM below and away from other heat-dissipating components.Note Placing the sbRIO-9651 SOM within a system or enclosure will alsoinfluence thermal performance.Figure 4-6 shows good, better, and best thermal mounting solutions for the sbRIO-9651 SOM.Figure 4-6. Thermal Mounting Solutions Comparison1 Good—Horizontal mounting with no additional thermal provisions2 Better—Vertical mounting with an attached heat sink, as described in Figure 4-33 Best—Vertical mounting directly to a thermally-conductive wall or plate, as described in Figure 4-11 2 3