Nokia 6260 Repair Hints

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Nokia 6260 Repair Hints Manual pdf 4 page image

CONFIDENTIAL 4 (21)Customer Care / Service & Support Readiness Repair HintsCompetence Transfer Team Version 1.0 ApprovedCopyright © 2005 Nokia 03.02.2005 6260 / RM-25Edited by:TBEChecked by:SCCEApproved by:MKO/PRZGeneral- How to use this documentPut the colored schematics behind this manual.Now you are able to follow these specifications with graphical layouts, and it is easier for you to find thecomponents and measuring points.- Component characteristicsSome components contain important data such as tuning values or security data; therefore, several stepsdescribed are only feasible if you are able to reflash/ realign the phone and/or rewrite IMEI/SIMlock in certaincases. Please pay attention to separate notes.- Broken balls / underfill, μBGAsAll replaceable (not underfilled) μBGA components must be renewed after removing. Reflow withuncontrolled hot-air fan is strictly forbidden! It is also not recommended only to reflow the old μBGA using aμBGA rework station! μBGA must only be soldered with Nokia approved μBGA rework machines (e.g. Zevac/OK-Metcal/ Martin) to get durable solder joints.Check soldering points after removing a μBGA; if necessary rework oxidated solderings (broken balls)carefully by tinplating these areas with few flux and a hot soldering iron. Before placing a new componentremove the tin and clean the PWB; e.g. with help of solder wick and flux cleaner such as “Kontakt LR”.Use only recommended flux type and an appropriate amount of it – avoid drowning the PWB in flux as thiswill lead to additional faults!Also check underfilled parts for broken underfill material below. In this case carefully evaluate possible repairactions as the phone probably was exposed to strong mechanical stress.“rework” done with uncontrolledhot air PWB drowned in flux broken underfill of a μBGA part